Unlock instant, AI-driven research and patent intelligence for your innovation.

Method to prevent needle burning during probe card testing

A testing process and probe card technology, applied in electronic circuit testing, single semiconductor device testing, components of electrical measuring instruments, etc., can solve the problems of probe burnout, tip discharge, etc., to avoid burnout and improve use effect of life

Active Publication Date: 2019-01-04
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the wafer-level testing process of existing large-scale integrated circuits, because the probe card is easy to accumulate charges on the probes during the test process, when the probe card lifts the needle at high speed and leaves the wafer after the test is completed, it is easy to generate tip discharge , if this situation occurs too many times and exceeds the physical limit of the probe, the probe will be burned

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method to prevent needle burning during probe card testing
  • Method to prevent needle burning during probe card testing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] In order to make the purpose, features, and advantages of the present invention more obvious and understandable, the technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention.

[0012] combine figure 1 As shown, the method for preventing needle burning during the test process of the probe card is in the following examples, and the implementation process is as follows;

[0013] The method is an algorithm of a test program, and the realization of the algorithm requires a hardware test system composed of a large logic tester, an automatic probe station and a probe card.

[0014] Whenever the probe card moves to a new chip or a group of chips under test, all test channels connected to all chips under test, including the power supply voltage, are set to low level (0V), and the decoupling on the power supply The capacitive switch is turned on, and this process lasts for t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a probe-burnout preventing method for a probe card in the test process. When the probe card is moved to one or a group of new tested chips, all test channels connected to all of the tested chips, and power supply voltage are set to be in a low level; a decoupling capacitor switch on a power supply is turned on to enable charges accumulated on all of the test channels before to be discharged; and when one or a group of new tested chips fail in some test item in the test process, the failed chips are removed immediately, that is, all of the test channels are powered down. The method can improve the service life of the probe card.

Description

technical field [0001] The invention relates to the field of wafer-level testing of large-scale integrated circuits, in particular to a method for preventing needle burning during testing of probe cards. Background technique [0002] In the wafer-level testing process of existing large-scale integrated circuits, because the probe card is easy to accumulate charges on the probes during the test process, when the probe card lifts the needle at high speed and leaves the wafer after the test is completed, it is easy to generate tip discharge , if this situation occurs too many times and exceeds the physical limit of the probe, the probe will be burned Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a method for preventing needle burning during the testing process of the probe card, so as to improve the service life of the probe card. [0004] In order to solve the above-mentioned technical problems, the method for p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/067G01R31/28G01R31/26
CPCG01R1/067G01R31/26G01R31/2851
Inventor 辛吉升桑浚之
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP