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A device that improves the uniformity of wafers

A technology with uniform heating and wafers, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as poor uniformity of wafer film thickness, and achieve the effect of improving heating uniformity and avoiding thermal effects.

Active Publication Date: 2018-02-02
SHENYANG KINGSEMI CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of poor film thickness uniformity caused by uneven heating of the wafer, the purpose of the present invention is to provide a device for improving the uniformity of wafer heating

Method used

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  • A device that improves the uniformity of wafers
  • A device that improves the uniformity of wafers
  • A device that improves the uniformity of wafers

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Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0024] Such as Figure 1~5 As shown, the present invention includes a lifting mechanism 1, a heating mechanism 2 and a foundation 3, wherein the lifting mechanism 1 and the heating mechanism 2 are installed on the foundation 3 respectively.

[0025] The lifting mechanism 1 comprises a power unit 101, an upper sealing cover 102, a thimble 103, a support frame 104, a fixed plate 105, a supporting plate 106 and a connecting frame 107, and the power unit 101 is fixed on the foundation 3 (the power unit 101 of the present embodiment is a cylinder ), the output end of the power unit 101 is fixedly connected with a connecting frame 107; the upper sealing cover 102 is disc-shaped, and is fixed on the connecting frame 107 through a support frame 104; The circumferential direction is evenly fixed on the fixed plate 105, which is fixedly connected with the connecting f...

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Abstract

The invention relates to equipment for heating wafers when entering the hot plate process, specifically a device for improving the heating uniformity of wafers, including a lifting mechanism, a heating mechanism and a foundation. The lifting mechanism includes an upper sealing cover, a thimble and a Based on the power device, the upper sealing cover and thimble are respectively located on the upper and lower sides of the heating mechanism, and are respectively linked with the power device to lift synchronously; the heating mechanism includes a lower sealing body, a lower cover plate, a heating plate and a heating wire, and the lower The cover is installed on the foundation, the bottom of the lower sealing body is sealed and connected to the edge of the lower cover, and the top is sealed and connected with the upper sealing cover to form a process chamber for accommodating wafers. The heating plate is placed on the lower cover and coiled in the middle There are heating wires, and the lower cover is provided with exhaust grooves; the wafer is supported by thimbles passing through the lower cover and the heating plate. The invention improves the sufficient contact between the heating wire and the heating disc body, increases the gap between the wafer and the heating disc body, and realizes the heating uniformity of the entire wafer.

Description

technical field [0001] The invention relates to equipment for heating a wafer when entering a hot plate process, in particular to a device for improving the heating uniformity of the wafer. Background technique [0002] At present, the requirements for the overall heating of the wafer are getting higher and higher when the wafer is sent into the hot plate for pre-baking or post-baking. The overall heating uniformity of the wafer directly affects the uniformity of film thickness and the formation of critical dimensions. When the current hot plate is heated to the set temperature, the air temperature around the heating wire will increase and the gas will expand. With the continuous expansion, the heating wire and the heating plate cannot be fully contacted, which affects the uniformity of heating; secondly, the distance between the wafer and the surface of the heating plate cannot be adjusted in the past, which will also affect the uniformity. Contents of the invention [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
Inventor 王丽鹤
Owner SHENYANG KINGSEMI CO LTD
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