Dual-layer fractal microstrip radio-frequency package antenna based on hollow cavity structure

Abstract

The invention proposes a dual-layer fractal microstrip radio-frequency package antenna based on a hollow cavity structure, which is used for solving the technical problems of large volume and poor application flexibility of a traditional package antenna. The dual-layer fractal microstrip radio-frequency package antenna comprises a first dielectric substrate, a second dielectric substrate, a third dielectric substrate and a fourth dielectric substrate which are sequentially laminated from top to bottom, a first air cavity and a second air cavity are respectively arranged at the centers of the second dielectric substrate and the third dielectric substrate and have closed cuboid structures, a first metal patch and a second metal patch are respectively printed on the upper surfaces of the second dielectric substrate and the third dielectric substrate and have first-order Minkowski fractal structures, a cavity is arranged at the center of the fourth dielectric substrate, a plurality of longitudinal second metallic through holes are formed on the peripheral side walls of the cavity, and a third metal patch and a fourth metal patch are respectively printed on the lower surfaces of the third dielectric substrate and the fourth dielectric substrate. The dual-layer fractal microstrip radio-frequency package antenna is small in volume and high in application flexibility, and can be used for wireless communication in 2.38-2.59GHz frequency bands.

Description

technical field [0001] The invention belongs to the technical field of microwave communication, and relates to a double-layer microstrip radio frequency package antenna, in particular to a cavity-based double-layer fractal microstrip radio frequency package antenna, which can be used for wireless communication in the 2.38GHz-2.59GHz frequency band. Background technique [0002] With the development of wireless communication technology, antenna-in-package technology has attracted more and more attention. The antenna-in-package technology can integrate the radiation unit, components, and chips into one body, greatly improving the integration and system performance, so it has become a research hotspot in both scientific research and commercial fields. [0003] The RF package antenna is suitable for miniaturization of the dielectric antenna. By integrating the package cavity in the antenna system, the system-level packaging technology is used to integrate multi-function chips an...

AI Technical Summary

Problems solved by technology

[0011] The purpose of the present invention is to overcome the defects of the above-mentioned prior art, and propose a double-layer fractal microstrip radio-frequency package antenna based on a cavity structure, which is used to solve the problem that the existing double-layer microstrip radio-frequency package antenna is too large and difficult to apply Technical issues with less flexibility

Images