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A kind of lead-free halogen-free roll coating solder paste and preparation method thereof

A roll-coating and solder paste technology, applied in the field of lead-free halogen-free roll-coating solder paste and its preparation, can solve the problems of poor anti-oxidation performance of solder paste, unable to keep moist for a long time, and re-oxidation without protection, and achieve universal The hole welding process is uniform and smooth, the printing effect is excellent, and the repeatable printing effect is good.

Active Publication Date: 2018-05-11
DONGGUAN XIANFEI ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1) The formula contains organic acid, which will cause the organic acid to react with the tin powder during the long-term printing process of the solder paste, which will accelerate the oxidation of the tin powder and eventually lead to soldering failure;
[0007] 2) The thixotropy of the solder paste is too poor or the viscosity of the solder paste recovers too slowly after shearing, resulting in under-soldered phenomenon;
[0008] 3) Solder paste is prone to broken tin and pores during the coating process, resulting in a higher void rate;
[0009] 4) The anti-oxidation performance of solder paste is not good, and there is no functional component to protect and prevent re-oxidation after soldering;
[0010] 5) The wetting effect of solder paste is poor, and it is prone to intermittent wetting, and it cannot keep moist for a long time without drying out;
[0011] 6) Solder paste is prone to crusting when refrigerated at low temperature

Method used

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  • A kind of lead-free halogen-free roll coating solder paste and preparation method thereof
  • A kind of lead-free halogen-free roll coating solder paste and preparation method thereof
  • A kind of lead-free halogen-free roll coating solder paste and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0050] Add 4.5 grams of ethylene glycol ether and 5 grams of modified hydrogenated rosin to the mixing reaction kettle, preheat at 80°C for 5-15 minutes; raise the temperature to 150°C, heat and stir until completely dissolved, to obtain a mixed solution, when mixed When the solution was cooled to 80°C, 0.8 g of DL-malic acid, 0.6 g of hydrogenated castor oil and 0.8 g of hydroquinone were added, and then fully stirred. 1 gram propylene glycol and 1 gram naltrexone, stir evenly, let stand, cool to room temperature to get flux paste, add the prepared flux paste into the grinder, grind and store it in a refrigerator at 0-10°C. After 12 hours, return to room temperature, take 14 grams of flux paste and 86 grams of Sn 89.5 Sb 10 Ni 0.5 Stir evenly in the mixing tank, and obtain lead-free and halogen-free roll-coating solder paste by vacuum degassing, and then pack it into cans or syringes according to the requirements of the use process, vacuumize, and store at 0-10 ℃. in the r...

Embodiment 2

[0052] Add 4 grams of ethylene glycol phenyl ether and 4 grams of fully hydrogenated rosin into the mixing reaction kettle, preheat at 90°C for 5 to 15 minutes; raise the temperature to 170°C, heat and stir until completely dissolved to obtain a mixed solution. When the solution was cooled to 80 °C, 0.7 g of sebacic acid, 0.7 g of sodium polyamide and 0.6 g of ethylene glycol benzole were added, and then fully stirred, then cooled to 52 °C, and 1.0 g of monoisooctyl phosphate, 0.5 g of Glycerol, 0.5g naloxone, stir evenly, let stand, cool to room temperature to get flux paste, add the prepared flux paste into the grinder, grind and store it in a refrigerator at 0-10°C After refrigerating for 12 hours, return to room temperature, take 12 grams of flux paste and 88 grams of Sn 90 Bi 8.5 Ag 1.5 Stir evenly in the mixing tank, and obtain lead-free and halogen-free roll-coating solder paste by vacuum degassing, and then pack it into cans or syringes according to the requirements ...

Embodiment 3

[0054] Add 2.7 grams of ethylene glycol and 3.2 grams of fully hydrogenated rosin to the mixing reaction kettle, preheat at 80°C for 5 to 15 minutes; raise the temperature to 150°C, heat and stir until completely dissolved to obtain a mixed solution, when the mixed solution is cooled When it reaches 80 °C, add 0.5 g of citric acid, 0.4 g of sodium polyamide and 0.1 g of benzotriazole, stir well, and then place it to cool to 50 ° C, continue to add 0.1 g of phenyl glycidyl ether and 0.5 g of glycerol. , 0.5 g of naloxone, stir evenly, let stand, cool to room temperature to get soldering paste, add the prepared soldering paste into the grinder, grind it and store it in a refrigerator at 0-10°C for 12 hours. , return to room temperature, take 8 grams of flux paste and 92 grams of Sn 90 Bi 10 Stir evenly in the mixing tank, and obtain lead-free and halogen-free roll-coating solder paste by vacuum degassing, and then pack it into cans or syringes according to the requirements of t...

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Abstract

The invention relates to the technical field of solder paste, in particular to lead-free and halogen-free roll coating solder paste and a preparation method thereof. The lead-free and halogen-free roll coating solder paste comprises, by weight percentage, 82-92% of allow solder powder, 2.7-6.0% of organic solvents, 3.2-5.4% of film-forming agents, 0.5-1.8% of organic acid, 0.4-1.5% of thixotropic agents, 0.1-1.5% of surface active agents, 0.1-1.6% of preservatives, 0.5-2.0% of humectants and 0.5-2.0% of slow release agents. The lead-free and halogen-free roll coating solder paste has the advantages of being good in oxidation resistance, good in welding effect, capable of avoiding crusting during low-temperature storage, and capable of being kept wet for a long time without being dry.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a lead-free halogen-free roller coating solder paste and a preparation method thereof. Background technique [0002] Solder paste, mainly used in the soldering of electronic components and printed circuit board pads, is a soldering material that came into being with surface mount technology (SMT). Apply solder paste, and place the surface mount components on the solder paste-coated pads accurately. Heat the circuit board according to a specific reflow temperature curve to melt the solder paste. The technology of forming solder joints with printed circuit boards to achieve metallurgical connection. [0003] With the rapid development of electronic technology, the integration of electronics is becoming more and more prominent, and the requirements for solder paste are also getting higher and higher. Due to the advantages of cost and performance, lead-containing solder pastes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/22B23K35/363B23K35/40B23K101/42
CPCB23K35/22B23K35/362B23K35/40B23K2101/42
Inventor 轩飞
Owner DONGGUAN XIANFEI ELECTRONICS MATERIAL CO LTD
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