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Antennas and electronic equipment including antennas

A technology for electronic equipment and antennas, applied to antennas, sub-office equipment, antenna components, etc., can solve problems such as grounding and antenna radiation weakening

Active Publication Date: 2019-05-03
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, manufacturers must address the weakening of grounding and antenna radiation due to the use of metallic materials on the exterior of electronic equipment

Method used

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  • Antennas and electronic equipment including antennas
  • Antennas and electronic equipment including antennas
  • Antennas and electronic equipment including antennas

Examples

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Embodiment Construction

[0027] Herein, the embodiments of the present invention are described by referring to the accompanying drawings. While specific embodiments of the present invention are shown in the drawings and related detailed descriptions are provided to assist in a comprehensive understanding of various embodiments of the present invention, various specific details are provided in the following description to assist in a comprehensive understanding, but This embodiment is just an example. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications can be made in the various embodiments described herein without departing from the spirit and scope of the invention. Also, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

[0028] The terms and words used in the following description and claims are not limited to their bibliographical meanings, but, are used to enable a clear and consistent understandin...

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PUM

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Abstract

The invention provides an antenna and electronic equipment including the antenna. The antenna includes a substrate, an antenna radiator fed from the substrate, at least one metal member disposed close to the antenna radiator, a connector member electrically connected to the substrate, and a dielectric is disposed between the connector member and the at least one metal member. capacitor formed between.

Description

technical field [0001] The present disclosure relates generally to electronic devices, and more particularly to electronic devices including antennas. Background technique [0002] With the development of electronic communication technology, electronic devices having multiple functions have been developed to have integrated functions for performing one or more functions. [0003] In recent years, as the functional gap between manufacturers has narrowed, the thickness of electronic devices has become smaller, even though the electronic devices have become slimmer in order to meet consumers' demands for enhanced rigidity and improved design. The increase in rigidity of electronic devices is achieved by replacing parts (eg, exterior parts) with metallic materials that are attractive to consumer demands for both high quality and improved appearance. Manufacturers, however, must address the weakening of grounding and antenna radiation due to the use of metallic materials on the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/24H01Q1/27H01Q1/36H04M1/02
CPCH01Q1/242H01Q1/243H01Q1/36H04M1/0202H01Q5/328H01Q5/378H01Q1/48
Inventor 朴柱欢
Owner SAMSUNG ELECTRONICS CO LTD