Cooling device for notebook computer and notebook computer

Abstract

The invention discloses a laptop cooling device and a laptop. The laptop cooling device comprises a first cooling module and a second cooling module, wherein the first cooling module comprises a first cooling fan, a first heat pipe, a CPU (Central Processing Unit) cooling plate and a first radiator; the CPU cooling plate is arranged above a CPU chip; one end of the first heat pipe is welded to the CPU cooling plate, and the other end of the first heat pipe penetrates through the first radiator; the first radiator is installed on the outlet of the first cooling fan; the second cooling module comprises a second cooling fan, a second heat pipe, the GPU (Graphics Processing Unit) cooling plate and a second radiator, wherein the GPU cooling plate is arranged above the GPU chip; one end of the second heat pipe is welded to the GPU cooling plate, and the other end of the second heat pipe penetrates through the second radiator; the second radiator is installed on the outlet of the second cooling fan; and the first cooling fan and the second cooling fan are independently arranged on two sides of a host. Two sets of cooling modules can be adopted to effectively improve the cooling effect of the laptop so as to improve the performance of the laptop.

Description

technical field [0001] The invention relates to the field of computer hardware, in particular to a cooling device for a notebook computer and a notebook computer. Background technique [0002] A laptop is a small, portable personal computer, usually weighing 1-3 kg. With the advancement of technology, the size of notebooks is getting smaller and lighter, but the overall performance requirements are getting higher and higher, and the function requirements are getting stronger and stronger. At the same time, there are more and more components, and the operating frequency of each component is getting higher and higher. The higher the power consumption, the higher the power consumption, and the higher the heat dissipation requirements inside the notebook. [0003] At present, most notebook computers on the market adopt a heat dissipation structure with a single cooling fan, a single heat pipe, and a single radiator. However, this heat dissipation method has poor heat dissipati...

AI Technical Summary

Problems solved by technology

However, this heat dissipation method has poor heat dissipation and poor user experience, mainly because: First, the cooling fan is the power source of airflow inside the notebook, which plays a role of forced convection. The way of flow, dissipating to the outside of the host, plays a vital role in the heat dissipation of the notebook

Inside the notebook, due to the limited space, the air volume provided by the single cooling fan structure is limited, which cannot meet the heat dissipation requirements of existing high-performance and high-power consumption notebooks

Second, the heat pipe is a transmission tool between the heat source and the heat dissipation terminal. It can greatly take away the heat from the internal chip of the notebook to the heat dissipation end. However, the single heat pipe structure connects the CPU chip and the graphics card chip, etc., which is easy to cause heat pipes on a unit area. If the thermal load is too large, the effective length of the notebook heat pipe becomes longer, the heat transfer efficiency of the heat pipe decreases or even reaches the limit of heat transfer, and the heat from the heat source cannot be transferred to the heat dissipation end in time

Third, the radiator is a heat dissipation terminal, and the heat dissipation area of ​​a single radiator is small, and the heat taken away is also limited

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