Package structure and method of fabricating same

Abstract

Provided are a package structure and a method of fabricating the same. A package structure includes: a substrate; an electronic component disposed on the substrate and having a sensing region; a first encapsulant formed on the substrate and encapsulating the electronic component; and a second encapsulant formed on the first encapsulant, wherein the sensing region of the electronic component faces the second encapsulant, the second encapsulant is harder than the first encapsulant, and the first encapsulant encapsulates the sensing region. Therefore, the sensing region can be protected from being touched by a finger, and the electronic component can thus be protected from being damaged.

Description

technical field [0001] The invention relates to a package structure, especially a package structure of a fingerprint sensor. Background technique [0002] With the improvement of living standards, consumers pay more and more attention to privacy. Many high-end electronic products will be equipped with identification systems to increase the security of data in electronic products. Therefore, the development and design of identification systems are also following consumers. Demand has become the direction of electronics industry development. [0003] With the development of the technology industry, the identification system is developing towards the biometric system. In the biometric identification system, it can be broadly divided into two types of biometric identification based on different identification targets: identification of biological characteristics (such as fingerprints, pupils, faces, and voiceprints) and behavioral characteristics (such as signatures and voices)...

AI Technical Summary

Problems solved by technology

[0007] However, the silicon crystal fingerprint image sensor needs to directly touch the sensing region 110 of the sensing chip 11 with a finger, so that the surface of the sensing region 110 is easily damaged, thus shortening the service life of the existing fingerprint image sensor

[0008] In addition, in response to the trend of personalization of high-end electronic products, the touch area of ​​the screen often needs to have surfaces of different colors due to aesthetic requirements, and the sensing area 110 cannot meet the expectations of personalization of high-end electronic products.

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