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COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns

A metal heat-conducting column, LED chip technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problem of inability to reduce the junction temperature of the PN junction of the light-emitting chip, and achieve the effects of reducing the junction temperature, easy industrialization, and simple production process

Inactive Publication Date: 2016-06-08
SHANGHAI TOPLITE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the technical defect in the prior art that the PN junction temperature of the light-emitting chip cannot be reduced, the purpose of the present invention is to provide a COBLED metal heat-conducting column that has a good heat dissipation effect on the fluorescent glue, reduces the temperature of the PN junction of the LED chip, and improves the service life of the product. A light source, including at least one LED chip 2 disposed on the light-emitting area 11 of the substrate, and a fluorescent adhesive layer 31 is bonded to the light-emitting area 11 of the substrate;

Method used

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  • COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns
  • COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns
  • COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns

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Embodiment Construction

[0030] In order to better clearly express the technical solution of the present invention, the present invention will be further described below in conjunction with the accompanying drawings. Those skilled in the art understand that the structural diagrams shown in the drawings are mainly used to illustrate the embodiments, and the components in the figure are not drawn in actual scale, and their shapes and structures are mainly used to represent the components and their interrelationships. Those skilled in the art The technical content of the present invention can be realized with reference to the embodiments shown in the accompanying drawings.

[0031] figure 1 It shows a specific embodiment of the present invention, an explosion diagram of a COBLED light source with a metal heat-conducting column, and those skilled in the art understand that, figure 1 Only according to a preferred drawing method of the present invention, the COBLED light source of the metal heat conduction...

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Abstract

The invention discloses a COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns. The COB LED light source comprises at least one LED chip (2) arranged in a light emitting area (11) of a substrate, wherein a fluorescent glue layer (31) is bonded at the light emitting area (11) of the substrate, at least one metal heat-conducting column (4) is also arranged at the light emitting area (11) of the substrate; and the fluorescent glue layer (31) covers the LED chip (2) and the metal heat-conducting columns (4). The COB LED light source disclosed by the invention has the effects that heat of fluorescent glue covering on the LED lamp chip is conducted to the substrate by the metal heat-conducting columns, so that the temperature of PN junctions of the LED chip is reduced. The COB LED light source has the advantages of being fast in heat dissipation, high in light-emitting efficiency and easy in industrialization.

Description

technical field [0001] The invention belongs to the technical field of optical lighting lamps, and in particular relates to a COB LED light source of a metal heat conduction column. Background technique [0002] COB LED light source is a high-efficiency integrated surface light source that pastes LED chips directly on a mirror metal substrate with high reflectivity and uses COB packaging technology to bond with the circuit board through bonding wires. Compared with other structures of LED light sources, it has Due to the advantages of fast heat dissipation, convenient light distribution, no reflow soldering, and reduced difficulty in lamp design, it has been more and more widely used in the field of LED packaging technology. [0003] At present, the demand for high-power, high-integration, and high-efficiency COBLED light sources is becoming more and more widespread in the market, and the temperature of the fluorescent rubber surface of high-power, high-integration, and high...

Claims

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Application Information

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IPC IPC(8): H01L33/64H01L33/48
CPCH01L33/64H01L33/48
Inventor 李建胜
Owner SHANGHAI TOPLITE TECH