Polycrystal ingot furnace internally provided with heat exchanger and carrier gas heating device
A heating device and a technology for polycrystalline ingots, which are applied in the directions of polycrystalline material growth, single crystal growth, single crystal growth, etc., can solve problems such as affecting the conversion efficiency of solar cells, reduce preparation energy consumption, inhibit impurity nucleation, The effect of reducing the impact
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Embodiment approach 1
[0090] A polycrystalline ingot furnace with built-in heat exchanger and carrier gas heating device of the present invention, such as figure 2 As shown, the polycrystalline ingot furnace includes an ingot furnace body 10 , a heating device 60 and a heat exchanger 70 . The heat exchanger 70 and the heating device 60 are arranged inside the ingot furnace body 10 for heating the carrier gas. The heat exchanger 70 is arranged outside the heat insulation cage 14 built in the ingot furnace body 10, and the heating device 60 is arranged inside the heat insulation cage 14, between the heater 15 built in the ingot furnace body 10 and the heat insulation cage 14 , wherein the heater 15 is arranged inside the heat insulation cage 14 . The output end of the heat exchanger 70 communicates with the input end of the heating device 60 , the input end of the heat exchanger 70 communicates with the gas delivery pipe 50 for transporting the carrier gas, and the output end of the heating device ...
Embodiment approach 2
[0096] The difference between Embodiment 2 and Embodiment 1 is only that: a flow guiding device 20 is set in the polycrystalline ingot furnace, such as Figure 5 , Image 6 As shown, the flow guiding device 20 is used to divide the carrier gas into multiple beams of outgoing carrier gas flows, and the outgoing carrier gas flows are blown obliquely to different regions of the surface of the liquid silicon, forming carrier gas stress distributed around the center of the liquid silicon, and the carrier gas stress drives the liquid silicon. The silicon flows and forms a rotating flow field for circumferential flow in the liquid silicon. The air guide device 20 is provided with an air inlet 213 through which the carrier gas flows. The heating device adopts a heating tube, and the output end of the heating tube is communicated with the air inlet 213 of the flow guiding device 20 through the connecting pipe 61, and the input end is connected with the second heat exchanger 72 (if a p...
Embodiment approach 3
[0105] The difference between Embodiment 3 and Embodiment 1 is only that: the polycrystalline ingot furnace has a built-in guide device 30, such as Figure 14 , Figure 15 As shown, the flow guide device 30 is used to divide the carrier gas into multiple streams of outgoing carrier gas flows, and the outgoing carrier gas flows are respectively obliquely blown to different regions of the surface of the liquid silicon to form carrier gas stress distributed along the circumferential direction around the center of the liquid silicon, and the carrier gas The stress drives the liquid silicon to flow, and a rotating flow field for circumferential flow is formed in the liquid silicon. An air inlet 33 through which the carrier gas flows is provided on the outer surface of the flow guiding device 30 . The heating device adopts a heating tube, and the output end of the heating tube is communicated with the air inlet 33 of the flow guiding device 30 through the connecting pipe 61, and th...
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