Silicon ingot cutting equipment and silicon ingot cutting method

Abstract

The invention provides silicon ingot cutting equipment and a silicon ingot cutting method. The silicon ingot cutting method comprises the following steps: placing a to-be-cut silicon ingot on a silicon ingot carrying platform; driving a linear cutting unit to move towards the silicon ingot carrying platform and driving the movement of a cutting line; feeding the cutting line from the first to-be-cut surface of the to-be-cut silicon ingot and carrying out primary cutting; after finishing primary cutting, adjusting the to-be-cut surface of the to-be-cut silicon ingot from the first to-be-cut surface to the second to-be-cut surface, wherein the cutting width of the first to-be-cut surface and the second to-be-cut surface, corresponding to the cutting line, is smaller than or equal to the width of at least one half of the other surfaces of the to-be-cut silicon ingot; driving the linear cutting unit to move towards the silicon ingot carrying platform and driving the movement of the cutting line; feeding the cutting line from the second to-be-cut surface of the to-be-cut silicon ingot and carrying out secondary cutting until cutting is fully finished; and finishing the cutting operation of the to-be-cut silicon ingot. In the cutting process, the silicon ingot cutting method has the advantages of being short in effective line segments, small in tension fluctuation range, high in cutting stability, quick in cutting progress and the like.

Description

technical field [0001] The invention relates to the field of silicon ingot prescription, in particular to a silicon ingot prescription equipment and a silicon ingot prescription method. Background technique [0002] Silicon wafers are one of the essential raw materials for making chips or solar cells. The production process is roughly as follows: grow the purified and processed silicon materials and cast them into silicon ingots, and then cut the silicon ingots into sizes that meet the requirements. Silicon block, and then slice the silicon block, and then get silicon wafers after a series of processing. Among the above-mentioned processes, the process of cutting the silicon ingot into silicon blocks with the required size is called the square extraction process. As far as the common opening process is concerned, firstly, the silicon ingot needs to be bonded to the crystal tray with an adhesive, and then the crystal tray bonded with the silicon ingot is placed in the cuttin...

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a silicon ingot squaring equipment and a silicon ingot squaring method, which are used to solve the tension and tension of different parts in the cutting line segment in the existing silicon ingot squaring technology. Balanced, causing damage to the cutting line, uneven wear or breakage

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