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Apparatus for partially growing film and coating and application of apparatus

A thin film and coating technology, which is applied in the direction of coating, metal material coating process, gaseous chemical plating, etc., can solve the problems of waste of raw materials, complicated operation, environmental pollution, etc., and achieve the reduction of chemical by-products, reduction of demand, The environment has the most effect

Active Publication Date: 2016-06-22
肖志凯
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, if the entire surface does not need to be covered by chemical products, then a complex template or photoresist (photoresist) process is required to complete the surface coating work, and the operation is complicated.
Moreover, since the places that do not need to be covered are also covered during the spraying process, the demand for chemical reaction gases in chemical vapor deposition is increased, and raw materials are wasted.
At the same time, the resulting chemical by-products also increase, causing pollution to the environment

Method used

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  • Apparatus for partially growing film and coating and application of apparatus
  • Apparatus for partially growing film and coating and application of apparatus
  • Apparatus for partially growing film and coating and application of apparatus

Examples

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Effect test

Embodiment 1

[0035] Embodiment 1 A kind of device suitable for local growth film and coating

[0036] like Figure 1-Figure 7 As shown, a device suitable for local growth of thin films and coatings has the following structure:

[0037] The main body of an apparatus suitable for locally growing thin films and coatings consists of a vacuum vessel 1 . The vacuum container 1 maintains a vacuum state. One or two mechanical vacuum pumps can generate sufficient vacuum. The degree of vacuum is controlled in the range of 25 Torr (Torr) to 0.001 Torr (Torr) or higher according to the performance requirements of different deposited films or coatings.

[0038] Metal, non-metal or semiconductor materials need to be printed or deposited on the surface of the substrate 4 through the device, so the substrate 4 needs to be placed in the vacuum container 1 . According to this, a support 2 for placing the substrate 4 needs to be installed inside the vacuum vessel 1; usually, a plurality of substrates 4 a...

Embodiment 2

[0055] Embodiment 2 A kind of method of local growth thin film and coating

[0056] 1) The control device 11 controls the laser source 3 to directly irradiate the beam onto the area 27 of the locally grown thin film or coating on the surface of the substrate 4, and heats the surface of the locally grown thin film and coated area 27 to a set temperature;

[0057] 2) the control device controls the gas outlet 18 of the gas ejection device to correspond to the surface of the region 27 of the locally grown film or coating;

[0058] 3) The gas reactant is output from the gas storage tank 6, reaches the gas injection device through the gas pipeline 5, and is sprayed from the gas outlet to the surface of the substrate, and the gas reactant chemically reacts on the heated substrate surface to generate a solid product Deposited on the surface of the substrate to form a film and / or coating.

[0059] 4) if Figure 8 As shown, the control device controls the excimer laser to move to the...

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Abstract

The invention relates to an apparatus for partially growing a film and coating and application of the apparatus. The usage of the apparatus includes the steps: by a laser source, irradiating a beam directly to an area of a base to be used for growing a film and / or a coating, and heating the surface of the area to be used for growing the film and / or coating, to a set temperature; by a control device, controlling a gas outlet of a gas ejector to align with the surface of the area to be used for growing the film and / or coating; discharging gas reaction material from a gas storage tank to the gas ejector through a gas line, spraying from the gas outlet to the surface of the base, chemically reacting the gas reaction material on the surface of the heated base, and depositing generated solid product on the surface of the base to form the film and / or coating. The invention enables the growth of the film and coating on the partial area of the base, materials are greatly saved, and the environment is protected.

Description

technical field [0001] The invention relates to a device and method for directly printing metal, non-metal or semiconductor materials on the surface of a substrate by applying chemical vapor deposition technology. Background technique [0002] The methods of growing metal, non-metal and semiconductor films or coatings on the surface of substrates by chemical vapor deposition (Chemical Vapor Deposition) (CVD) are well known. In a traditional chemical vapor deposition (CVD) process, chemical reactants react chemically on the entire surface of the heated substrate, and after the chemical reaction, the reaction products are deposited on the heated entire surface. In this way, if the entire surface does not need to be covered by chemical products, then a complex template or photoresist (photoresist) process is required to complete the surface coating work, and the operation is complicated. Moreover, since the places that do not need to be covered are also covered during the spra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/04C23C16/02
CPCC23C16/0209C23C16/047
Inventor 肖志凯
Owner 肖志凯