A Method for Acquiring Graph Electroplating Parameters
An acquisition method and pattern electroplating technology, applied in electrical components, electrolytic processes, electrolytic components, etc., can solve the problems of distribution density and double-sided conductivity deviation, and achieve the effect of high production parameter setting accuracy
Active Publication Date: 2018-06-22
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
[0002] At present, in the process of electroplating copper, nickel or gold on the circuit board, due to many factors such as the distribution density, isolation, and double-sided conductivity of the product graphics, the graphics electroplating parameter setting and Faraday There are clear deviations from the law
Method used
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Embodiment Construction
[0033] Embodiments of the present invention are described in detail below:
[0034] The obtaining method of pattern electroplating parameter of the present invention comprises the steps:
[0035] Obtain the electroplating area of the SS surface, the electroplating area of the CS surface, the setting current density of the SS surface, and the setting current density of the CS surface of the circuit board; wherein, the SS surface represents the soldering surface of the circuit board, and the CS surface represents the plug-in surface of the circuit board.
[0036] Calculate the actual current density of the SS surface and / or the actual current of the CS surface according to the first built-in algorithm according to the electroplating area of the SS surface, the electroplating area of the CS surface, the set current density of the SS surface, and the set current density of the CS surface. density;
[0037] The actual current density of the SS surface and / or the actual cur...
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Disclosed is a method for acquiring a pattern plating parameter, comprising the following steps: acquiring the plating area of an SS surface, the plating area of a CS surface, the current setting density of the SS surface and the current setting density of the CS surface; calculating, according to the plating area of the SS surface, the plating area of the CS surface, the current setting density of the SS surface and the current setting density of the CS surface, the actual current density of the SS surface and / or the actual current density of the CS surface according to a first internal algorithm; and substituting the actual current density of the SS surface and / or the actual current density of the CS surface and a plating time of a metal to be plated into a Faraday formula H = κ·D·η·t to obtain a plating thickness H of the metal plated on the SS surface and / or the CS surface of a circuit board. According to the method for acquiring a pattern plating parameter, the actual plating thickness of a welding surface and that of an insert surface can be obtained before a circuit board is plated, and a current density parameter can also be obtained through backstepping according to the plating area and the plating layer thickness of the welding surface and those of the insert surface, so that the setting accuracy of a production parameter of the circuit board is relatively high.
Description
technical field [0001] The invention relates to the technical field of circuit board electroplating, in particular to a method for acquiring graphic electroplating parameters. Background technique [0002] At present, in the process of electroplating copper, nickel or gold on the circuit board, due to many factors such as the distribution density, isolation, and double-sided conductivity of the product graphics, the graphics electroplating parameter setting and Faraday There are clear deviations from the law. Especially in the production process of IC substrates, due to factors such as low residual copper rate and isolated plated area, it is very difficult to set the current density parameters of pattern plating, and multiple first board confirmations are required to determine how Set the current density parameter. Contents of the invention [0003] Based on this, the present invention overcomes the defects of the prior art and provides a method for obtaining pattern ele...
Claims
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IPC IPC(8): C25D21/12C25D5/02H05K3/18
CPCC25D5/02C25D21/12H05K3/188H05K3/18C25D7/00
Inventor 田生友李志东谢添华
Owner GUANGZHOU FASTPRINT CIRCUIT TECH