Power semiconductor package having reduced form factor and increased current carrying capability

Abstract

A power semiconductor package is disclosed. The power semiconductor package includes a leadframe having partially etched segments and at least one non-etched segment, a first semiconductor die having a first power transistor and a driver integrated circuit (IC) monolithically formed thereon, a second semiconductor die having a second power transistor, wherein the first semiconductor die and the second semiconductor die are configured for attachment to the partially etched segments, and wherein the partially etched segments and the at least one non-etched segment enable the first semiconductor die to be coupled to the second semiconductor die by a legless conductive clip.

Description

Background technique [0001] This application claims the benefit of and priority to Provisional Patent Application Serial No. 62 / 092,753, filed December 16, 2014, entitled "SmallFormFactorPowerConverterPackagewithIntegratedPowerTransistors." The disclosure in this provisional application is hereby fully incorporated by reference into this application. [0002] The high DC voltage is often converted to a low DC voltage using a power converter such as a buck converter. Power converters typically include high-side and low-side switches connected in a half-bridge configuration. A power converter may include a driver integrated circuit (IC) for controlling the duty cycle of either or both of the high-side and low-side switches to convert a high input voltage to a low output voltage. In order to improve form factor, performance and manufacturing cost, it is often desirable to integrate components of a power converter circuit, such as a half-bridge based DC-DC converter or voltage c...

AI Technical Summary

Problems solved by technology

However, it is difficult to manufacture the leg portion of the conductive post to match the precise height of the semiconductor device in a conventional power semiconductor package

As a result, the leg portions may tilt the conductive post toward or away from the semiconductor device, which in turn may cause an unreliable electrical connection between the conductive post and the semiconductor device, and thereby limit the current carrying capability of the conductive post.

Additionally, the increased packaging complexity resulting from the use of multiple conductive posts can negatively impact manufacturing time, cost, and package yield

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