Method for manufacturing mask plate assembly for evaporation of OLED

Abstract

The invention provides a method for manufacturing a mask plate assembly for evaporation of an OLED. The method comprises the following steps of: S1, a step of manufacturing a mask supporting layer; S2, a step of manufacturing a mask layer; and S3, a step of assembling the mask plate assembly, wherein the mask plate assembly manufactured by virtue of the method comprises at least one mask unit, and each mask unit is composed of two layers of structures including the mask layer and the mask supporting layer. By reasonably arranging the two layers of structures including the mask layer and the mask supporting layer of each mask unit, the mask plate assembly provided by the invention has a relatively high position precision, deposition of an organic material on the surface of a follow-up OLED substrate can be better satisfied, and the quality of an OLED product is effectively improved.

Description

technical field [0001] The invention belongs to the display panel manufacturing industry, and in particular relates to a method for manufacturing a mask plate component for evaporation used in the manufacturing process of an OLED display panel. Background technique [0002] Because organic light-emitting diodes (Organic Light-Emitting Diode, OLED) have self-illumination at the same time, do not need backlight, high contrast, thin thickness, wide viewing angle, fast response speed, can be used for flexible panels, wide temperature range, structure and The excellent characteristics such as relatively simple manufacturing process are considered to be the emerging application technology of the next generation of flat panel displays. [0003] The most important part in the OLED production process is to evaporate the organic layer onto the substrate according to the requirements of the drive matrix to form a key light-emitting display unit. OLED luminescent material is a solid ma...

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Problems solved by technology

[0006] However, there is still an unavoidable technical problem in the above prior art, because the evaporation region 211 and the non-evaporation region 212 on the mask unit 21 have completely different structures (such as Figure 5 As shown, the vapor deposition area 211 is a through-hole array structure, and the non-evaporation area 212 is a non-through-hole array structure), and the mask unit 21 is stretched by an external mechanism (stretching will cause a certain deformation of the board surface), The physical stress of each area on the surface is not uniform, so the deformation of each area has a certain difference, which makes it difficult to control the position accuracy of the through holes for depositing organic materials on the evaporation area 211 on the mask unit

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