Magnetron sputtering cathode surface gas density distribution control device and method
A cathode surface and gas density technology, which is applied in the direction of sputtering plating, ion implantation plating, metal material coating process, etc., can solve the problems of poor film thickness uniformity, large difference, sputtering deposition rate difference, etc., to achieve gas The effect of uniform density distribution
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[0015] See image 3 , 4 In the shown flexible, continuous type magnetron sputtering cathode surface gas density distribution control device, the shielding cover 1 includes a panel 11 and a peripheral plate 12, and the cathode target 2 is located in the shielding cover 1. The peripheral plate 12 is provided with a working (reactive) gas injection port 5.
[0016] A rectangular hole 13 is opened on the shielding cover panel. In the four inner corners of the rectangular hole 13 on the upper part of the panel, two shielding baffles 3 and 4 are stacked one after another. The two shielding baffles 3 and 4 at each inner corner cover each Inner corner. In this way, the rectangular hole 13 removes the four inner corners 131 that are blocked by the shielding plate to form a waist-shaped sputtering hole 14. The length direction of the waist-shaped sputtering hole is consistent with the length direction of the cathode target. The two ends of the waist-shaped sputtering hole are broken line...
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