Three-axis mems inertial sensor system-in-package unit structure

Abstract

The invention relates to the technical field of three-dimensional integrated circuit application, and provides a system-in-package unit structure of a triaxial MEMS (micro-electromechanical system) inertial sensor. The system-in-package unit structure comprises a cuboid substrate and a metallized pattern which is plated on the surface of the substrate and used for electrical connection of the MEMS inertial sensor; orthogonal encapsulation of the triaxial MEMS inertial sensor is unitized, polished ALN is taken as a base material, and requirements for low stress, flatness and orthogonality of assembly of the MEMS inertial sensor are met; the metallized pattern has very good adaptability and can meet the assembly requirement of multiple types of MEMS inertial sensors; with the adoption of the unitized encapsulation structure form, modularization and standardization of the triaxial inertial sensor unit are conveniently realized, triaxial orthogonal assembly of the sensor can be realized without installation of any bracket, the size and the weight are reduced, the efficiency is improved, errors are reduced, the cost is low, the applicable range is wide, and the practicability is high.

Description

technical field [0001] The invention belongs to the technical field of application of three-dimensional integrated circuits, and relates to a three-axis orthogonal system-level packaging method, in particular to a structural design of a system-level package unit of a three-axis MEMS inertial sensor. Background technique [0002] With the requirements of miniaturization and systematization of multi-axis inertial sensing devices in military navigation, control and civilian high-end measurement fields, and at the same time ensuring high precision and long-term stability of measurement, the package size of three-axis inertial sensors is constantly shrinking . The traditional 2D packaging technology adopts X and Y-axis plane assembly, and the Z-axis needs to be orthogonal to the other two axes, which is a difficult point of packaging. Currently, the packaging in the Z-axis direction uses a cubic or right-angled triangle bracket to fix the sensor to achieve three-axis inertial Th...

AI Technical Summary

Problems solved by technology

The traditional 2D packaging technology uses X and Y axis plane assembly, and the Z axis needs to be orthogonal to the other two axes, which is a difficult point of packaging. Currently, the packaging in the Z axis direction uses a cubic or right-angled triangle bracket to fix the sensor to achieve three-axis inertial The size and weight of the orthogonal package of the sensor are difficult to meet the requirements of the miniaturized system, and the orthogonality accuracy is affected by the machining accuracy and installation accuracy of the bracket. The product consistency, stability, and orthogonality are poor, and the installation efficiency lower

For monolithically integrated three-axis inertial sensors, the manufacturing process is difficult and the precision is low, which cannot meet the needs of high-end inertial sensing fields.

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