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Method for preparing white LED

A technology of white light and white glue, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of uneven color of white light and blue light leakage of chips, and achieve the effect of uniform and saturated white light color, low cost and simple operation method

Active Publication Date: 2016-06-29
JIANGXI LATTICEBRIGHT
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Problems solved by technology

However, in the above-mentioned packaging process, only a layer of fluorescent glue is coated on the surface of the chip, and the surrounding area of ​​the chip is not coated with fluorescent glue, so there will be blue light leakage around the chip, resulting in the blue light leakage of the packaged white LED device, making the color of white light not good. Uniform, often with yellow or blue spots

Method used

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  • Method for preparing white LED
  • Method for preparing white LED
  • Method for preparing white LED

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Embodiment Construction

[0017] In order to further illustrate the preparation method of a white light LED chip provided by the present invention, a specific preparation process thereof will be described below. This embodiment adopts the following steps:

[0018] (1) Die bonding: first fix the flip-chip LED chip 2 on the substrate 1 arranged in an array with flux (such as figure 1 As shown), the substrate 1 is provided with electrical connection lines; then the substrate after die bonding is baked by reflow soldering at a baking temperature of 150°C and a baking time of 8 minutes;

[0019] (2) Paste a fluorescent film on the surface of the LED chip 2, mix the silica gel main agent, curing agent and yellow fluorescent powder in the fluorescent film in a weight ratio of 1:2:0.24, and stir evenly to form a fluorescent film; The excitation wavelength of the yellow phosphor is 560nm;

[0020] (3) White glue coating and curing: make a mold 3 corresponding to the substrate 1, such as figure 2 As shown, t...

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Abstract

The invention provides a method for preparing a white LED. The method of preparing the white LED comprises the steps of fixing an LED chip on a substrate arranged in an array; attaching a fluorescent film on the surface of the LED chip; making a mold corresponding to the substrate, arranging a projection corresponding to the size and shape of the surface of LED chip and for covering the surface of the LED chip onto the mold, and filling the mold with white glue slightly lower than the height of the projection; buckling the substrate fixed with the LED chip onto the mold, flipping the mold, and removing the mold after the white glue is formed at the periphery of the LED chip, baked and cured; forming a transparent silicone lens on the surface of the white LED coated with the white glue at the periphery; and cutting the substrate to forming a single white LED. The method avoids the phenomenon of blue light leakage of the white LED by coating the periphery of the LED chip with the white glue through the mold, the operation method is simple, low in cost and high in working efficiency, and the white light emitted by the packaged white LED is uniform and saturated in color, with no yellow or blue spot.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a preparation method of a white light LED. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LED is widely used as a new lighting source material. As a new type of light source, white LEDs are rapidly developing due to their advantages such as fast response, good shock resistance, long life, energy saving and environmental protection. Has been widely used in landscaping and indoor and outdoor lighting and other fields. [0003] At present, there are low-power in-line, low-power SMD and high-power white LED packaging methods. Regardless of the method, the production of white light mainly adopts the process of coating yellow phosphor powder on the blue light chip. The specific...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/54
Inventor 江柳杨李金玉周智明章少华
Owner JIANGXI LATTICEBRIGHT
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