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A kind of manufacturing method of white light led chip

An LED chip and manufacturing method technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of high cost, low work efficiency, and complicated operation, and achieve the effects of low cost, high work efficiency, and simple operation method.

Active Publication Date: 2019-08-06
LATTICE POWER (JIANGXI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is complex in operation, high in cost and low in work efficiency

Method used

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  • A kind of manufacturing method of white light led chip
  • A kind of manufacturing method of white light led chip
  • A kind of manufacturing method of white light led chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] As shown in FIG. 2, a method for manufacturing a white LED chip includes preparing a GaN LED wafer with a vertical structure on a silicon substrate 201, such as Figure 2a 202 in the figure is the bonding metal layer, and the gallium nitride LED 203 is separated by the scribe line 204; the 355nm ultraviolet laser emitted by the laser is focused to the middle position of the upper surface groove scribe line 204 of the silicon substrate 201, forming a depth of 30± 5 μm, a groove 205 with a width of 20±2 μm, such as Figure 2b ; Use titanium dioxide doped silica gel to configure white glue 206 with high reflectivity to fill in the cutting line 204 and groove 205, grind and thin the white glue so that its height is flush with the upper surface of the LED chip, as Figure 2c , wherein the mass percentage of titanium dioxide in the white glue is 50%, and then cured at a baking temperature of 150°C for 1h; a layer of phosphor 207 is coated on the gallium nitride LED 203 and ba...

Embodiment 2

[0018] Another method for manufacturing a white LED chip includes preparing a GaN LED wafer with a vertical structure on a silicon substrate 301, such as Figure 3a , 302 in the figure is the bonding metal layer, the gallium nitride LED 303 is separated by the dicing line 304; the white glue 305 with high reflectivity configured with zinc oxide doped silica gel is filled in the dicing line 304, and the white glue is ground and thinned. make its height flush with the upper surface of the LED chip, as Figure 3b , wherein the mass percentage of zinc oxide in the white glue is 60%, and then cured at a baking temperature of 150°C for 1h; a layer of fluorescent adhesive film 306 is pasted on the gallium nitride LED 303 and baked and cured, such as Figure 3c As shown; the wafer is cut along the dicing road 304 to obtain a single white LED chip surrounded by white glue, such as Figure 3d shown.

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Abstract

A method for manufacturing a white LED chip, characterized in that it includes the following steps: preparing a GaN LED wafer with a vertical structure through a substrate transfer process; filling white glue in the dicing lane of the GaN LED wafer and baking and solidifying it; A layer of fluorescent glue is formed on the LED chip of the wafer; the wafer is cut along the dicing line to obtain a single white LED chip surrounded by white glue. Compared with the prior art, the present invention avoids the phenomenon of blue light leakage of the white light LED by coating white glue around the wafer-level LED chip, and has simple operation method, low cost and high work efficiency, and the white light LED emitted by the package is The white light color is uniform and saturated without yellow or blue spots.

Description

technical field [0001] The invention relates to the field of production and preparation of light-emitting diodes. More specifically, the present invention relates to a manufacturing method of a white LED chip. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LED is widely used as a new lighting source material. As a new type of light source, white LEDs are rapidly developing due to their advantages such as fast response, good shock resistance, long life, energy saving and environmental protection. Has been widely used in landscaping and indoor and outdoor lighting and other fields. [0003] Commercial white light LEDs all use the process of coating yellow phosphor on the blue light chip. The specific process is as follows: first fix the chip on the bracket, and connect the chip electrode...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/00
Inventor 李金玉郭苑章少华
Owner LATTICE POWER (JIANGXI) CORP
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