A kind of preparation method of white light LED chip

Abstract

The invention discloses a preparation method of a white LED chip. The method is characterized by comprising the following preparation steps: (1) preparing a high-reflectivity white gum screen frame; (2) putting the white gum screen frame on a high temperature resistant film or a UV film; (3) putting the LED chip into the white gum screen frame; (4) manufacturing a fluorescent powder layer on the LED chip and a surface layer of the white gum screen frame; and (5) carrying out cutting along a groove, and expanding the film to obtain a single LED chip with high-reflectivity gum on the periphery. The white LED chip prepared according to the technical scheme is uniform in white light color, avoids the phenomenon of blue light leakage and has the characteristics of good thermal conductivity, small light-emitting angle and the like.

Description

technical field [0001] The invention relates to the field of semiconductor light emitting diodes, in particular to a preparation method of a white LED chip. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light. Light, thus directly converting electrical energy into light energy. LED, especially white LED, is widely used as a new lighting source material. It has the advantages of fast response, good shock resistance, long life, energy saving and environmental protection, etc. and has developed rapidly. It has been widely used in landscaping and Indoor and outdoor lighting and other fields. [0003] At present, the production of white light LED is mainly made by coating yellow phosphor powder on the blue light chip, that is, directly coating or spraying a layer of phosphor powder on the surface of the blue light LED chip. The white light LED chip produced by ...

AI Technical Summary

Problems solved by technology

[0003] At present, the production of white light LED is mainly made by coating yellow phosphor powder on the blue light chip, that is, directly coating or spraying a layer of phosphor powder on the surface of the blue light LED chip. The white light LED chip produced by the above process is as follows Two problems: one is that only a layer of phosphor glue is coated on the surface of the blue LED chip, but the side of the chip is not coated with phosphor glue, so there will be blue light leakage around the chip, resulting in the white light color of the final packaged white LED device. Uneven, often with yellow or blue spots; Second, the white LED chip prepared by the above method emits light from five sides, and most of the side light becomes ineffective light, and the utilization rate of light has not been effectively improved

In addition, in some application fields that require LED products to have the characteristics of miniaturization, integration, and smaller lighting angles, LED chips prepared by traditional methods cannot meet the requirements of these fields.

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