88results about How to "Small light angle" patented technology

The invention discloses a terminal equipment screen, a control method and a control device of the terminal equipment screen. The terminal equipment screen comprises a liquid crystal panel (1), a firstbacklight module (2) and a second backlight module (3) which are sequentially stacked; the liquid crystal panel (1), the first backlight module (2) and the second backlight module (3) are encapsulated into an integrated structure; the first backlight module (2) is used for providing directional light, and the directional light enters the liquid crystal panel (1) along a fixed direction; and the second backlight module (3) is used for providing non-directional light, and the non-directional light enters the liquid crystal panel (1) along an unfixed direction. The terminal equipment screen adopts a double-layer backlight structure, wherein the first backlight module can reduce the light-emitting angle, performs directional light emission and has peep-proof characteristic; and the second backlight module can realize large-angle light emission and does not have peep-proof characteristic. The peep-proof mode and the non-peep-proof mode of the terminal equipment can be freely switched by switching the use of the first backlight module and the second backlight module in the double-layer backlight structure.

The present invention discloses an LED three-dimensional optical system design method with given illumination distribution and an optical system, which belongs to the non-imaging optical technique of the applied optics field. A three-dimensional non-imaging optical system is formed in a region which has given illumination distribution, by using a light emitting diode as a light source. A three-dimensional lens is designed with the optical system. According to the geometrical shape of the given illumination distribution region, complying with the law of conversation of energy, the surface of the light source and the illumination plane are divided into corresponding energy regions on the long axis direction of the region in accordance with optical refraction, and energy division is carried out in the short axis direction in accordance with the principle of common function of total internal reflection and refraction. The coordinates and the normal vectors of all feature points of the optical system surface of the light source along the long axis direction and the short axis direction are calculated according to the energy corresponding relationship, so as to determine the optical system surface. The method and the system contribute to sufficiently utilizing energy and reducing engineering cost. The encapsulation of the optical system is flexible. Single chip encapsulation and multi-chip encapsulation can be adopted. The arrangement of a plurality of the optical systems is free, simple and flexible.

The invention provides a monochromatic light chip scale packaging light emitting device having asymmetric light shape. The device comprises a flip-chip LED chip and a reflecting structure and can also comprise a florescent structure so as to form a white light chip scale packaging light emitting device having the asymmetric light shape. The florescent structure comprises a florescent layer and a light transmitting layer, and the bottom surface at least covers the upper surface of the LED chip. The reflecting structure at least partially shields the vertical surface of the LED chip and the side surface of the florescent structure. The invention also provides a manufacturing method of the light emitting device. Therefore, the light emitting angle of the chip scale packaging light emitting device can be effectively limited in a specific direction so as to provide the asymmetric light shape, and thus the application requirements of asymmetric lighting or light source can be met without using additional optical lens and the application advantage of small size can also be maintained.

The invention provides a liquid crystal display device which comprises a liquid crystal panel. The liquid crystal panel comprises a quantum-dot color pixel layer, an upper polarizer, a liquid crystal switch unit and a lower polarizer which are sequentially arranged in a stacked mode, wherein the quantum-dot color pixel layer comprises a red sub-pixel unit, a green sub-pixel unit and a blue sub-pixel unit. The display device also comprises a backlight module arranged below the liquid crystal panel. The backlight module comprises a back plate and a light-emitting device arranged on the back plate, wherein the light-emitting device comprises an LED light-emitting device and an optical alignment device arranged above the LED light-emitting device. According to Lach invariants, the aperture of a light emergency hole is increased by arranging the optical alignment device arranged above the LED light-emitting device, according a light emergency angle of backlight is decreased, aligned light emergency is achieved to some degree, and thus the problem of inter-pixel color crosstalk brought by larger backlight emergency angle when the liquid crystal panel displays pictures is improved.

The invention discloses a condenser lens of an LED (light emitting diode). The condenser lens is a rotary body in a shape of a circular truncated cone and is provided with an optical axis which is superposed with a rotary shaft of the rotary body. The condenser lens comprises a light source containing slot, a light emitting surface and a full reflecting surface, wherein the light source containing slot corresponds to a small end of the condenser lens, the light emitting surface corresponds to a large end of the condenser lens, the full reflecting surface is arranged on the outer sidewall of the condenser lens, the light source containing slot is a cylindrical slot, the bottom of the cylindrical slot is provided with an outwards protruded conical surface, the vertex of the conical surface is positioned on the optical axis, and corresponding parts of the conical surface and the light emitting surface commonly define one central light condensation part. Compared with the prior art, the condenser lens of the LED, disclosed by the invention, has a high-efficiency condensation function on the LED, and emergent light is almost parallel to the optical axis and a luminescence angle is very small after light rays emitted by the LED are acted by the condenser lens of the LED; the condenser lens of the LED can improve the utilization rate of a lamp on the luminous flux of the LED; and the condenser lens is also relatively and simply machined and formed.

The invention discloses a direct-type macro LED package structure and a direct-type macro LED light mixing device and belongs to the technical field of backlight sources. The direct-type macro LED package structure comprises a PCB substrate and a plurality of LED chips fixedly arranged on the PCB substrate, wherein a light mixing layer is also fixedly arranged on the PCB substrate and coats the plurality of LED chips; the light mixing layer is filled with a fluorophor; a plurality of reflecting layers which correspond to the plurality of LED chips one by one are also fixedly arranged at the upper end of the light mixing layer; and the reflecting layers are arranged opposite to the corresponding LED chips. The direct-type macro LED light mixing device comprises the direct-type macro LED package structure, a lower diffusion film, a bright enhancement film, an upper diffusion film and a reflecting frame. According to the direct-type macro LED package structure, the light mixing distance can be significantly reduced and the thickness of the package structure is reduced. The direct-type macro LED light mixing device is smaller in thickness and more uniform in light emitting.

The present invention relates to the field of LED chip technology, and particularly relates to an LED chiplet and an LED chip invisible cutting method. The LED chiplet is disclosed, wherein the side surface of a substrate of the LED chiplet is provided with a plurality (three or more) of spaced laser scratches along the thickness direction of the substrate, and the side surface of the substrate is arranged in an up-and-down manner along the thickness direction of the substrate. The method is also provided, including a step S1) of forming a plurality of (three or more) laser scratches spaced along the thickness direction of the substrate inside the substrate in a cutting passage by adopting invisible cutting. According to the LED chiplet and the method, the yield of chiplet cutting is increased, substrate inclination is reduced, and the width of cutting passage lines can be reduced, thus increasing the yield from one chip. Side light extraction is increased, the light emitting angle is increased and forward-direction light is increased, thus increasing the brightness of the chiplet.

The invention discloses a chip scale packaging light-emitting device and a manufacturing method thereof. The light-emitting device comprises a flip chip type LED chip and a beam shaping structure to form a single-color light-emitting device, and the light-emitting device can also comprise a fluorescent structure arranged on the LED chip to form a white light-emitting device. The beam shaping device disclosed by the structure is formed by mixing optical scattering particles with a high polymer material and is arranged at a side part of the light-emitting device or at an upper part of the light-emitting device, and the weight percent of the optical scattering particles is not larger than 30%. Therefore, the transfer paths of a part of light beams can be changed by the beam shaping structure due to optical scattering characteristic, the light rays emitted in a lateral direction can be reduced when the beam shaping structure is arranged at the side part of the light-emitting device, the light rays emitted in a positive direction can be reduced when the beam shaping structure is arranged at the upper part of the light-emitting device, and thus, the beam shape and the light-emitting angle of the light-emitting device can be adjusted.

The invention is suitable for the field of lighting, and provides a spot lamp reflector, a spot lamp and a head lamp. The inner surface of the spot lamp reflector is of a paraboloid; the focal length of the paraboloid is between 2.4 and 2.6 mm; the focal point of the paraboloid is a luminous point of a light source; and the optical axis of the light source is overlapped with the central axis of a reflector. The inner surface of the spot lamp reflector is designed as the paraboloid of which the focal length is between 2.4 and 2.6mm; the focal point of the paraboloid is the luminous point of the light source; the optical axis of the light source is overlapped with the central axis of the reflector; and light spots formed by the light which is emitted from the light source and is emitted in parallel after being reflected by the reflector have the characteristics of uniformity, small radiant angle and perfect spotlight effect, so the spot lamp reflector can particularly serve as the reflector of the head lamp.

The invention discloses an inorganic-packaged self-focusing integrated UVLED module, which comprises a UVLED lamp component, a UVLED chip, an optical light guide plate, quartz glass and a front cover, wherein the UVLED lamp component comprises a copper-based circuit board; the copper-based circuit board is provided with a die bonding region; the UVLED chip is fixed at the middle part of the die bonding region; the optical light guide plate is used for reflecting light of the side surface of the UVLED chip and then ejecting the light through a normal direction of the UVLED chip; the front cover comprises a cover board with a groove structure; a notch of the groove structure is toward one side of the copper-based circuit board; the bottom of the groove structure is the front end surface; a light outlet window is formed in the front end surface; the quartz glass is bonded to the bottom of the groove structure by a sealant and covers the light outlet window; the rear end surface of the front cover is fixedly connected with the copper-based circuit board; a cavity is formed between the groove structure of the front cover and the copper-based circuit board; and the cavity is filled with a protective gas.

The invention relates to a surface adhesion type light-emitting component structure and a making method thereof. The structure comprises a first pin, a second pin, a conversion seat body and a lamp body, wherein the conversion seat body comprises a first surface and a second surface; the lamp body is arranged on the first surface and connected with the conversion seat body, and covers part of the first pin and second pin; and the first pin and the second pin are separately bent to extend to the second surface, and at least partially project out of the second surface to form a first guide connection part and a second guide connection part. The invention can utilize the characteristics of low cost, high power, small light emitting angle and high brightness of the plug-in light-emitting component, so that the light-emitting component can be combined with the conversion seat body to form a new surface adhesion type light-emitting component structure, thereby meeting the requirements on high power and high brightness, lowering the cost and simplifying the technique. In addition, the invention can be conveniently installed on a circuit carrier by an automatic technique, and can widen the application range of the plug-in light-emitting component.

The invention provides a preparation method of a white light chip. The preparation method comprises the steps of placing a fluorescent membrane on a support substrate; dispensing transparent silica gel on the surface of the fluorescent thin film according to a preset rule; placing an inverted blue-ray LED chip on the surface of the transparent silica gel and solidifying; cutting the fluorescent membrane along a cutting path; filling high-reflection glue between every two adjacent LED chips and solidifying; cutting along the grooves between the adjacent LED chips to obtain a single white lightchip. The white light emitted by the white light LED chip is uniform in color, the phenomenon of blue light leakage is avoided, the light emitting efficiency is high, and the light emitting angle is small.

The invention discloses a condenser lens of an LED (light emitting diode). The condenser lens is a rotary body in a shape of a circular truncated cone and is provided with an optical axis which is superposed with a rotary shaft of the rotary body. The condenser lens comprises a light source containing slot, a light emitting surface and a full reflecting surface, wherein the light source containing slot corresponds to a small end of the condenser lens, the light emitting surface corresponds to a large end of the condenser lens, the full reflecting surface is positioned on the outer sidewall of the condenser lens, the light source containing slot is a cylindrical slot, the bottom of the cylindrical slot is provided with an outwards protruded first conical surface, the middle part of the light emitting surface is sunken inwards so as to form a second conical surface and an annular surface, the second conical surface is arranged at the middle part of the light emitting surface and is protruded outwards, the annular surface surrounds the second conical surface, the vertexes of the first conical surface and the second conical surface are arranged on the optical axis, and the first conical surface and the second conical surface commonly define one central light condensation part. Compared with the prior art, the condenser lens of the LED, disclosed by the invention, has a high-efficiency condensation function on the LED, and emitted light is almost parallel to the optical axis after light rays emitted by the LED are acted by the condenser lens of the LED; and the condenser lens of the LED can improve the utilization rate of a lamp on the luminous flux of the LED.

The invention provides a white LED chip comprising a metal electrode, a flip-chip blue LED chip, a transparent silica gel, a high anti-adhesive and a fluorescent film, wherein the metal electrode is disposed on the surface of the electrode pad in the LED chip; the fluorescent film is provided on the upper surface of the LED chip with the area larger than the surface area of the LED chip and is symmetrically disposed along the center of the LED chip, and the fluorescent film is doped with titanium dioxide powder having a mass ratio of 0.5 to 5%; the transparent silica gel is arranged in an arcshape around the LED chip on the surface of the fluorescent film facing the fluorescent film; the high anti-adhesive is disposed around the LED chip along the surface of the transparent silica gel anddoes not exceed the metal electrode on the surface of the LED chip. In the white LED chip, the color uniformity of the white LED chip is better while reducing the difference between the color temperature of the center point of the white LED chip and the average color temperature.

The invention relates to a brightness enhancement film, which comprises a first surface, a second surface and a side face. The first surface is a curved surface which continuously fluctuates on two dimensions and comprises a plurality of axisymmetrical convex surfaces and a plurality of non-axisymmetrical concave surfaces, and each axisymmetrical convex surface is a curved surface; the axisymmetrical convex surfaces and the non-axisymmetrical concave surfaces are alternately arrayed on the two dimensions to form a plurality of wave crests and a plurality of wave troughs respectively, and each non-axisymmetrical concave surface is a curved surface; the second surface corresponds to the first surface; and the side face is connected with the first surface and the second surface. The invention also provides a backlight module using the brightness enhancement film.

The invention discloses a stage lamp. The stage lamp comprises a shell, an LED lamp assembly and an optical assembly. The LED lamp assembly and the optical assembly are both installed in the shell of the stage lamp. The optical assembly comprises a pattern disc assembly, a color disc assembly, a condensing lens, a multi-color disc assembly and a focusing lens. The multi-color disc assembly comprises at least one multi-color disc, a rotary frame for fixing the multi-color discs, and a third driving mechanism for driving the rotary frame to rotate. A pattern disc, a color disc, the focusing lens, the multi-color discs and the focusing lens are sequentially installed above the LED lamp assembly at intervals from bottom to top, and light emitted by the LED lamp assembly sequentially penetrates through the pattern disc, the color disc, the condensing lens, the multi-color discs and the focusing lens to be projected outwards. The set of multi-color discs are additionally arranged and formed by splicing three or more colorful color chips by 360 degrees, and after white light passes through the spliced color chips, a multi-color light beam, namely, a colorful light beam can be formed.

The invention provides an LED chip packaging method and an LED lamp bead. In the LED lamp bead prepared by the method, a red fluorescent glue layer and a green fluorescent glue layer are sequentiallyarranged on the light-emitting upper surface of the LED chip from bottom to top, so that the light emitted from the LED chip can be sequentially and uniformly converted in the two fluorescent glue layers, and finally, the LED lamp beads emit light more uniformly, the situations of color difference, yellow spots and the like can be reduced, and the light efficiency is improved. Besides, light blocking glue layers exist on the side faces of the LED chips in the LED lamp beads prepared through the method, the side face of the red fluorescent glue layer and the side face of the green fluorescent glue layer, and can block the light emitted by the LED chips, so that the light emitting angle can be reduced, and the LED lamp beads can be applied to more fields.

The embodiment of the invention provides a peep-proof film and a display device, relates to the technical field of peep-proof display, and can solve the problem that the light emitting angle of a display panel is large. The peep-proof film is arranged on the light emitting side of the display panel, the display panel comprises a black matrix, and the peep-proof film comprises: a substrate; a transparent dielectric layer which is positioned on the substrate, the surface, close to the substrate, of the transparent dielectric layer is provided with a plurality of grooves which are recessed towards the side away from the substrate and are arranged at intervals; and a plurality of light absorption structures which are used for absorbing light rays irradiated to the light absorption structures,wherein the light absorption structures are arranged in the groove and are in contact with the substrate, and at least one part of the vertical projections of the light absorption structures on the substrate is overlapped with at least one part of the vertical projection of the black matrix on the substrate. The peep-proof film and the display device are used in the peep-proof display device.