88results about How to "Small light angle" patented technology

The invention discloses a terminal equipment screen, a control method and a control device of the terminal equipment screen. The terminal equipment screen comprises a liquid crystal panel (1), a firstbacklight module (2) and a second backlight module (3) which are sequentially stacked; the liquid crystal panel (1), the first backlight module (2) and the second backlight module (3) are encapsulated into an integrated structure; the first backlight module (2) is used for providing directional light, and the directional light enters the liquid crystal panel (1) along a fixed direction; and the second backlight module (3) is used for providing non-directional light, and the non-directional light enters the liquid crystal panel (1) along an unfixed direction. The terminal equipment screen adopts a double-layer backlight structure, wherein the first backlight module can reduce the light-emitting angle, performs directional light emission and has peep-proof characteristic; and the second backlight module can realize large-angle light emission and does not have peep-proof characteristic. The peep-proof mode and the non-peep-proof mode of the terminal equipment can be freely switched by switching the use of the first backlight module and the second backlight module in the double-layer backlight structure.

The present invention discloses an LED three-dimensional optical system design method with given illumination distribution and an optical system, which belongs to the non-imaging optical technique of the applied optics field. A three-dimensional non-imaging optical system is formed in a region which has given illumination distribution, by using a light emitting diode as a light source. A three-dimensional lens is designed with the optical system. According to the geometrical shape of the given illumination distribution region, complying with the law of conversation of energy, the surface of the light source and the illumination plane are divided into corresponding energy regions on the long axis direction of the region in accordance with optical refraction, and energy division is carried out in the short axis direction in accordance with the principle of common function of total internal reflection and refraction. The coordinates and the normal vectors of all feature points of the optical system surface of the light source along the long axis direction and the short axis direction are calculated according to the energy corresponding relationship, so as to determine the optical system surface. The method and the system contribute to sufficiently utilizing energy and reducing engineering cost. The encapsulation of the optical system is flexible. Single chip encapsulation and multi-chip encapsulation can be adopted. The arrangement of a plurality of the optical systems is free, simple and flexible.

The application of the invention provides a liquid crystal display, comprising a liquid crystal panel that comprises a quantum dot color pixel layer, an upper polarizer, a liquid crystal box and a lower polarizer stacked in sequence; the quantum dot color pixel layer comprises red pixel unis, green pixel units and blue pixel units. The liquid crystal display also comprises a backlight module arranged below the liquid crystal panel, the backlight module comprises a back plate and a light-emitting device arranged on the back plate, and the light-emitting device comprises an LED light source and a light collimating structure arranged above the LED light source. According to Lagrange invariant, the light collimating structure is arranged above the LED light source, light outgoing aperture is enlarged, emergent angle of backlight is decreased, the light emerges under certain degree of collimation, and therefore, the problem that large backlight emergence angle of the liquid crystal panel during image displaying leads to inter-pixel color crosstalk is solved.

The invention provides a white-light LED chip preparation method, and the method is characterized in that the method comprises the steps: enabling blue-light LED chips to be arranged on a UV film; enabling the light-emitting surfaces of the blue-light LED chips to be attached to a fluorescent film, and forming white-light LED chips; placing high-reflection glue in a trench between the white-light LED chips, carrying out the vacuum defoamation, and carrying out baking and solidifying; cutting the high-reflection glue along the trench, and forming split white-light LED chips. According to the invention, the peripheries of the blue-light LED chips are coated with the high-reflection glue, so as to prevent the edges of the chips from emitting light, enable the manufactured white-light LED chips to be uniform in color, and avoid the leakage of blue light. In addition, the LED chip manufactured through the method is good in thermal conductivity, is small in light-emitting angle, and is low in cost, thereby enlarging the application range of the LED and the application convenience.

The invention provides a monochromatic light chip scale packaging light emitting device having asymmetric light shape. The device comprises a flip-chip LED chip and a reflecting structure and can also comprise a florescent structure so as to form a white light chip scale packaging light emitting device having the asymmetric light shape. The florescent structure comprises a florescent layer and a light transmitting layer, and the bottom surface at least covers the upper surface of the LED chip. The reflecting structure at least partially shields the vertical surface of the LED chip and the side surface of the florescent structure. The invention also provides a manufacturing method of the light emitting device. Therefore, the light emitting angle of the chip scale packaging light emitting device can be effectively limited in a specific direction so as to provide the asymmetric light shape, and thus the application requirements of asymmetric lighting or light source can be met without using additional optical lens and the application advantage of small size can also be maintained.

The invention provides a liquid crystal display device which comprises a liquid crystal panel. The liquid crystal panel comprises a quantum-dot color pixel layer, an upper polarizer, a liquid crystal switch unit and a lower polarizer which are sequentially arranged in a stacked mode, wherein the quantum-dot color pixel layer comprises a red sub-pixel unit, a green sub-pixel unit and a blue sub-pixel unit. The display device also comprises a backlight module arranged below the liquid crystal panel. The backlight module comprises a back plate and a light-emitting device arranged on the back plate, wherein the light-emitting device comprises an LED light-emitting device and an optical alignment device arranged above the LED light-emitting device. According to Lach invariants, the aperture of a light emergency hole is increased by arranging the optical alignment device arranged above the LED light-emitting device, according a light emergency angle of backlight is decreased, aligned light emergency is achieved to some degree, and thus the problem of inter-pixel color crosstalk brought by larger backlight emergency angle when the liquid crystal panel displays pictures is improved.

The invention discloses a condenser lens of an LED (light emitting diode). The condenser lens is a rotary body in a shape of a circular truncated cone and is provided with an optical axis which is superposed with a rotary shaft of the rotary body. The condenser lens comprises a light source containing slot, a light emitting surface and a full reflecting surface, wherein the light source containing slot corresponds to a small end of the condenser lens, the light emitting surface corresponds to a large end of the condenser lens, the full reflecting surface is arranged on the outer sidewall of the condenser lens, the light source containing slot is a cylindrical slot, the bottom of the cylindrical slot is provided with an outwards protruded conical surface, the vertex of the conical surface is positioned on the optical axis, and corresponding parts of the conical surface and the light emitting surface commonly define one central light condensation part. Compared with the prior art, the condenser lens of the LED, disclosed by the invention, has a high-efficiency condensation function on the LED, and emergent light is almost parallel to the optical axis and a luminescence angle is very small after light rays emitted by the LED are acted by the condenser lens of the LED; the condenser lens of the LED can improve the utilization rate of a lamp on the luminous flux of the LED; and the condenser lens is also relatively and simply machined and formed.

The invention discloses a direct-type macro LED package structure and a direct-type macro LED light mixing device and belongs to the technical field of backlight sources. The direct-type macro LED package structure comprises a PCB substrate and a plurality of LED chips fixedly arranged on the PCB substrate, wherein a light mixing layer is also fixedly arranged on the PCB substrate and coats the plurality of LED chips; the light mixing layer is filled with a fluorophor; a plurality of reflecting layers which correspond to the plurality of LED chips one by one are also fixedly arranged at the upper end of the light mixing layer; and the reflecting layers are arranged opposite to the corresponding LED chips. The direct-type macro LED light mixing device comprises the direct-type macro LED package structure, a lower diffusion film, a bright enhancement film, an upper diffusion film and a reflecting frame. According to the direct-type macro LED package structure, the light mixing distance can be significantly reduced and the thickness of the package structure is reduced. The direct-type macro LED light mixing device is smaller in thickness and more uniform in light emitting.

The present invention relates to the field of LED chip technology, and particularly relates to an LED chiplet and an LED chip invisible cutting method. The LED chiplet is disclosed, wherein the side surface of a substrate of the LED chiplet is provided with a plurality (three or more) of spaced laser scratches along the thickness direction of the substrate, and the side surface of the substrate is arranged in an up-and-down manner along the thickness direction of the substrate. The method is also provided, including a step S1) of forming a plurality of (three or more) laser scratches spaced along the thickness direction of the substrate inside the substrate in a cutting passage by adopting invisible cutting. According to the LED chiplet and the method, the yield of chiplet cutting is increased, substrate inclination is reduced, and the width of cutting passage lines can be reduced, thus increasing the yield from one chip. Side light extraction is increased, the light emitting angle is increased and forward-direction light is increased, thus increasing the brightness of the chiplet.

The invention provides a display substrate, a display panel and a display device. The display substrate includes a plurality of sub-pixel areas. Each sub-pixel area includes a shading area and openingareas on the two sides. A first transparent electrode is arranged in each sub-pixel area. Each first transparent electrode includes a first electrode unit located in the corresponding shading area. Each first electrode unit includes a plurality of first sub-electrodes. A first slit is arranged between the adjacent first sub-electrodes. The width of the first slits progressively increases in a direction from the centers of the shading areas to the sides where the shading areas and the opening areas are connected to each other. Liquid crystals corresponding to the small slits at the central areas of the shading areas can form large liquid crystal prism curvature, has large deflection angles to light and large light-emitting angles, and ensures light-emitting efficiency. Liquid crystals corresponding to the wide slits at the edge areas can form small liquid crystal prism curvature, has small deflection angles to light and small light-emitting angles, and ensures that the light does not be emitted out of the adjacent sub-pixel areas. The display substrate, the display panel and the display device solve the problem of cross-color.

The invention discloses an LED fluorescent lamp, comprising a base plate, an end cap, an aluminum profile, a light diffusing plate, a light guide plate component, a lamp shade, a power unit and a lamp panel component as well as an LED lamp bead on the lamp panel component; first slots are arranged on two left side walls of the aluminum profile; the light guide plate can rotationally sleeved in the first slots; the top of the lamp shade is provided with a holding groove, at the bottom of which a hollowed-out part is hollowed out; the light diffusing plate is fixed in the holding groove and provided with many stripes on the surface; the stripes are crossed to form diamond-shaped stripes; and two sides of the lamp shade are arcs. The invention has the advantages of high thermal radiation effect, soft light and better light-emitting angle.

The invention discloses a chip scale packaging light-emitting device and a manufacturing method thereof. The light-emitting device comprises a flip chip type LED chip and a beam shaping structure to form a single-color light-emitting device, and the light-emitting device can also comprise a fluorescent structure arranged on the LED chip to form a white light-emitting device. The beam shaping device disclosed by the structure is formed by mixing optical scattering particles with a high polymer material and is arranged at a side part of the light-emitting device or at an upper part of the light-emitting device, and the weight percent of the optical scattering particles is not larger than 30%. Therefore, the transfer paths of a part of light beams can be changed by the beam shaping structure due to optical scattering characteristic, the light rays emitted in a lateral direction can be reduced when the beam shaping structure is arranged at the side part of the light-emitting device, the light rays emitted in a positive direction can be reduced when the beam shaping structure is arranged at the upper part of the light-emitting device, and thus, the beam shape and the light-emitting angle of the light-emitting device can be adjusted.

The invention is suitable for the field of lighting, and provides a spot lamp reflector, a spot lamp and a head lamp. The inner surface of the spot lamp reflector is of a paraboloid; the focal length of the paraboloid is between 2.4 and 2.6 mm; the focal point of the paraboloid is a luminous point of a light source; and the optical axis of the light source is overlapped with the central axis of a reflector. The inner surface of the spot lamp reflector is designed as the paraboloid of which the focal length is between 2.4 and 2.6mm; the focal point of the paraboloid is the luminous point of the light source; the optical axis of the light source is overlapped with the central axis of the reflector; and light spots formed by the light which is emitted from the light source and is emitted in parallel after being reflected by the reflector have the characteristics of uniformity, small radiant angle and perfect spotlight effect, so the spot lamp reflector can particularly serve as the reflector of the head lamp.

The invention discloses an inorganic-packaged self-focusing integrated UVLED module, which comprises a UVLED lamp component, a UVLED chip, an optical light guide plate, quartz glass and a front cover, wherein the UVLED lamp component comprises a copper-based circuit board; the copper-based circuit board is provided with a die bonding region; the UVLED chip is fixed at the middle part of the die bonding region; the optical light guide plate is used for reflecting light of the side surface of the UVLED chip and then ejecting the light through a normal direction of the UVLED chip; the front cover comprises a cover board with a groove structure; a notch of the groove structure is toward one side of the copper-based circuit board; the bottom of the groove structure is the front end surface; a light outlet window is formed in the front end surface; the quartz glass is bonded to the bottom of the groove structure by a sealant and covers the light outlet window; the rear end surface of the front cover is fixedly connected with the copper-based circuit board; a cavity is formed between the groove structure of the front cover and the copper-based circuit board; and the cavity is filled with a protective gas.

The invention discloses a flip LED chip, which comprises a substrate, a light-emitting structure arranged on the surface of the substrate, a light-emitting film layer disposed on the back surface of the substrate, and phosphor and a packaging glue arranged on the light-emitting film layer, wherein the refractive index of the packaging glue is smaller than that of the light-emitting film layer, therefractive index of the light-emitting film layer is smaller than that of the substrate, the light transmittance of the light-emitting film layer is greater than 90%, and multiple holes are arrangedin the light-emitting film layer. Correspondingly, the invention also provides a flip LED chip making method. Through mutual match among the substrate, the light-emitting film layer and the packagingglue, by using different light refractive indexes and the holes in the light-emitting film layer, total reflection of the substrate is reduced, more light is induced to the light-emitting film layer,and besides, the holes in the light-emitting film layer can allow more light to overflow from the light-emitting film layer, the light-emitting efficiency of the chip is increased, and the chip brightness is improved.

The invention relates to the technical field of UV curing, in particular to a UVLED curing assembly for backlight. The UVLED curing assembly for the backlight comprises a plurality of UVLED light-emitting units and is characterized by further comprising a heat dissipation substrate, a heat dissipation system and a reflector, wherein the UVLED light-emitting units are arranged on the obverse side of the heat dissipation substrate; the heat dissipation system is arranged on the reverse side of the heat dissipation substrate; the reflector forms a reflection peripheral wall on the obverse side of the heat dissipation substrate, and the reflection peripheral wall is used for reflecting rays emitted by the UVLED light-emitting units; the reflector forms a light-transmitting plate on the top of the reflection peripheral wall, and the light-transmitting plate is used for allowing the rays emitted by the UVLED light-emitting units to pass through; the positions, corresponding to all the UVLED light-emitting units, of the light-transmitting plate are respectively provided with a reflector cup used for converging the rays emitted by the UVLED light-emitting units. The UVLED curing assembly for the backlight is simple in structure and high in curing efficiency.

The invention provides a preparation method of a white light chip. The preparation method comprises the steps of placing a fluorescent membrane on a support substrate; dispensing transparent silica gel on the surface of the fluorescent thin film according to a preset rule; placing an inverted blue-ray LED chip on the surface of the transparent silica gel and solidifying; cutting the fluorescent membrane along a cutting path; filling high-reflection glue between every two adjacent LED chips and solidifying; cutting along the grooves between the adjacent LED chips to obtain a single white lightchip. The white light emitted by the white light LED chip is uniform in color, the phenomenon of blue light leakage is avoided, the light emitting efficiency is high, and the light emitting angle is small.

The invention relates to a light source module and a lamp, wherein the light source module comprises at least one light-emitting component, a light-shielding component and a light-guiding component. The light-emitting component is suitable for emitting a light beam; the light-shielding component is arranged between the light-guiding component and the light-emitting component and provided with at least one light-transmitting hole and at least one spotlighting reflection side; and a clearance is arranged between the light-shielding component and the light-emitting component; a first part of the light beam passes through the light-transmitting hole to be transmitted to the light-guiding component and then penetrates through the light-guiding component; a second part of the light beam passes through the light-transmitting hole to be reflected and accumulated by the spotlighting reflection side and then penetrates through the light-guiding component; and a third part of the light beam is unable to be transmitted to the light-guiding component because of the shading of the light-shielding component. The invention also discloses a lamp employing the light source module. The light source module provided in the invention has a smaller light-emitting angle; and the lamp provided in the invention also has a smaller light-emitting angle.

The invention discloses a condenser lens of an LED (light emitting diode). The condenser lens is a rotary body in a shape of a circular truncated cone and is provided with an optical axis which is superposed with a rotary shaft of the rotary body. The condenser lens comprises a light source containing slot, a light emitting surface and a full reflecting surface, wherein the light source containing slot corresponds to a small end of the condenser lens, the light emitting surface corresponds to a large end of the condenser lens, the full reflecting surface is positioned on the outer sidewall of the condenser lens, the light source containing slot is a cylindrical slot, the bottom of the cylindrical slot is provided with an outwards protruded first conical surface, the middle part of the light emitting surface is sunken inwards so as to form a second conical surface and an annular surface, the second conical surface is arranged at the middle part of the light emitting surface and is protruded outwards, the annular surface surrounds the second conical surface, the vertexes of the first conical surface and the second conical surface are arranged on the optical axis, and the first conical surface and the second conical surface commonly define one central light condensation part. Compared with the prior art, the condenser lens of the LED, disclosed by the invention, has a high-efficiency condensation function on the LED, and emitted light is almost parallel to the optical axis after light rays emitted by the LED are acted by the condenser lens of the LED; and the condenser lens of the LED can improve the utilization rate of a lamp on the luminous flux of the LED.

The invention discloses an LED (light emitting diode) condenser lens. The condenser lens is a round-table revolution body and is provided with an optical axis overlapped with a revolution axis of the revolution body; the condenser lens comprises a light source containing tank corresponding to the small end of the condenser lens, a light emitting surface corresponding to the big end of the condenser lens, and a fully-reflecting surface located on the outer side wall of the condenser lens; the light source containing tank is a hemispherical tank; the light emitting surface sinks inward and forms a conical surface part in the middle and protruding outward and a plane part surrounding the conical surface part; the vertex of the conical surface part and the sphere center of the light source containing tank are located on the optical axis; and the light source containing tank and the conical surface part define a central condensation part together. Compared with the prior art, the LED condenser lens disclosed by the invention has an efficient condensation function on an LED; after the light emitted by the LED is processed by the LED condenser lens disclosed by the invention, the light emitting angle is very small; and the LED condenser lens disclosed by the invention also can remarkably improve the utilization rate of the LED luminous flux of a lamp while guaranteeing the condensation function.

The invention discloses a stage lamp with a colour light beam effect. The stage lamp comprises a housing, an LED lamp assembly and an optical assembly, wherein the LED lamp assembly and the optical assembly are both installed in the housing; the optical assembly comprises a pattern disc assembly, a colour disc assembly, a light-condensing lens, a multi-colour disc assembly, a prism assembly and a focusing lens, wherein a pattern disc, a colour disc, the light-condensing lens, multi-colour discs, a prism disc and the focusing lens are sequentially installed above the LED lamp assembly at intervals from bottom up; and the light emitted by the LED lamp assembly is projected outwards through the pattern disc, the colour disc, the light-condensing lens, the multi-colour discs, the prism disc and the focusing lens in sequence. According to the invention, an oscillating light beam lamp is used, a group of the multi-colour discs is added, each multi-colour disc is formed by bonding a plurality of colour sheets, and the multi-colour discs are used with a common prism, thus the effects of both colour light beams and a colour prism are achieved, so that stage light effects are more abundant.

The invention provides a white-light Nixie tube display device, and belongs to the technical field of Nixie tube packaging. The display device includes a PCB heat dissipation substrate, a plurality oflight sources disposed on the PCB heat dissipation substrate and a plurality of bonding pads disposed on the PCB heat dissipation substrate, and also comprises blue-light chips disposed on the bonding pads, fluorescent powder films overlying the blue-light chips, mixed adhesive layers disposed around the fluorescent powder films and the blue-light chips. The fluorescent powder films cover the surfaces of the blue-light chips by the adhesive layers, and the mixed adhesive layers are white nanoparticle mixed colloids. The display device has stable performances, large luminous intensity and highlight emission consistency. The packaging technology for the display device comprises the following steps: the cleaning, die bonding and testing of the PCB heat dissipation substrate cleaning, the preparation of a fluorescent powder mixed adhesive, the preparation and cutting of the fluorescent powder films, the spraying of the bonding layer, the pasting of the paste fluorescent powder films, thespraying of the mixed adhesive layers, and testing. The packaging technology can effectively inhibit the light-emitting angle of the chips, shortens the distances between stroke segments, saves the assembly step of a reflection cover, and controls the overall height of the display device.

The invention provides an LED lens and a lighting device, and relates to the technical field of LEDs. The LED lens comprises a containing cavity, a fully reflecting surface and a light emitting surface, the containing cavity is arranged at one end of the fully reflecting surface, the light emitting surface is arranged at the other end of the fully reflecting surface, the light emitting surface isarranged to be an arc convex surface sunk along the fully reflecting surface, the containing cavity is used for mounting of an LED light source, the end, close to the fully reflecting surface, of thecontaining cavity is provided with a first refracting portion protruding in the direction far away from the light emitting surface, a part of light emitted by the LED light source is refracted by thefirst refracting portion to be diffused to the light emitting surface, the other part of the light emitted by the LED light source is reflected by the fully reflecting surface to be diffused to the light emitting surface, and the light is refracted by the light emitting surface to be diffused out. The LED lens and the lighting device have the advantages that the light emitting angle of the entirelighting device is small, and the light emitting effect is better.

The invention provides a white LED chip comprising a metal electrode, a flip-chip blue LED chip, a transparent silica gel, a high anti-adhesive and a fluorescent film, wherein the metal electrode is disposed on the surface of the electrode pad in the LED chip; the fluorescent film is provided on the upper surface of the LED chip with the area larger than the surface area of the LED chip and is symmetrically disposed along the center of the LED chip, and the fluorescent film is doped with titanium dioxide powder having a mass ratio of 0.5 to 5%; the transparent silica gel is arranged in an arcshape around the LED chip on the surface of the fluorescent film facing the fluorescent film; the high anti-adhesive is disposed around the LED chip along the surface of the transparent silica gel anddoes not exceed the metal electrode on the surface of the LED chip. In the white LED chip, the color uniformity of the white LED chip is better while reducing the difference between the color temperature of the center point of the white LED chip and the average color temperature.

The invention discloses a light source, a backlight module using the same and a liquid crystal display device using the same. The light source comprises a base, a chip and a lens. The chip is arranged on the base. The lens has a flat surface, a curved surface and a long-axis direction. The flat surface is arranged relative to the curved surface. The chip is used for emitting a light beam passing through the lens. The light beam has a first direction light-emitting angle on a plane vertical to the long-axis direction. The curved surface has a curvature on the plane vertical to the long-axis direction. The first direction light-emitting angle of the light beam before entering the lens is greater than the first direction light-emitting angle of the light beam exiting from the lens. In the invention, the light-emitting angle of a light-emitting diode on a plane vertical to a light guide plate can be reduced, and thus, the efficiency of the light coupling between the light-emitting diode and the light guide plate is improved.

The invention relates to a brightness enhancement film, which comprises a first surface, a second surface and a side face. The first surface is a curved surface which continuously fluctuates on two dimensions and comprises a plurality of axisymmetrical convex surfaces and a plurality of non-axisymmetrical concave surfaces, and each axisymmetrical convex surface is a curved surface; the axisymmetrical convex surfaces and the non-axisymmetrical concave surfaces are alternately arrayed on the two dimensions to form a plurality of wave crests and a plurality of wave troughs respectively, and each non-axisymmetrical concave surface is a curved surface; the second surface corresponds to the first surface; and the side face is connected with the first surface and the second surface. The invention also provides a backlight module using the brightness enhancement film.

The invention discloses a stage lamp. The stage lamp comprises a shell, an LED lamp assembly and an optical assembly. The LED lamp assembly and the optical assembly are both installed in the shell of the stage lamp. The optical assembly comprises a pattern disc assembly, a color disc assembly, a condensing lens, a multi-color disc assembly and a focusing lens. The multi-color disc assembly comprises at least one multi-color disc, a rotary frame for fixing the multi-color discs, and a third driving mechanism for driving the rotary frame to rotate. A pattern disc, a color disc, the focusing lens, the multi-color discs and the focusing lens are sequentially installed above the LED lamp assembly at intervals from bottom to top, and light emitted by the LED lamp assembly sequentially penetrates through the pattern disc, the color disc, the condensing lens, the multi-color discs and the focusing lens to be projected outwards. The set of multi-color discs are additionally arranged and formed by splicing three or more colorful color chips by 360 degrees, and after white light passes through the spliced color chips, a multi-color light beam, namely, a colorful light beam can be formed.

The invention provides an LED chip packaging method and an LED lamp bead. In the LED lamp bead prepared by the method, a red fluorescent glue layer and a green fluorescent glue layer are sequentiallyarranged on the light-emitting upper surface of the LED chip from bottom to top, so that the light emitted from the LED chip can be sequentially and uniformly converted in the two fluorescent glue layers, and finally, the LED lamp beads emit light more uniformly, the situations of color difference, yellow spots and the like can be reduced, and the light efficiency is improved. Besides, light blocking glue layers exist on the side faces of the LED chips in the LED lamp beads prepared through the method, the side face of the red fluorescent glue layer and the side face of the green fluorescent glue layer, and can block the light emitted by the LED chips, so that the light emitting angle can be reduced, and the LED lamp beads can be applied to more fields.

The embodiment of the invention provides a peep-proof film and a display device, relates to the technical field of peep-proof display, and can solve the problem that the light emitting angle of a display panel is large. The peep-proof film is arranged on the light emitting side of the display panel, the display panel comprises a black matrix, and the peep-proof film comprises: a substrate; a transparent dielectric layer which is positioned on the substrate, the surface, close to the substrate, of the transparent dielectric layer is provided with a plurality of grooves which are recessed towards the side away from the substrate and are arranged at intervals; and a plurality of light absorption structures which are used for absorbing light rays irradiated to the light absorption structures,wherein the light absorption structures are arranged in the groove and are in contact with the substrate, and at least one part of the vertical projections of the light absorption structures on the substrate is overlapped with at least one part of the vertical projection of the black matrix on the substrate. The peep-proof film and the display device are used in the peep-proof display device.