Circuit board hole filling method and circuit board

A circuit board and plug hole technology, which is applied in the directions of printed circuit components, electrical connection of printed components, and the formation of electrical connection of printed components, can solve the problems of waste cost, high cost of vacuum plug holes, and increased process, so as to reduce production costs. , Improve the quality of plug holes and reduce the effect of bubble residue

Active Publication Date: 2016-06-29
新方正控股发展有限责任公司 +1
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  • Abstract
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Problems solved by technology

In this method, although the vacuum plugging machine can fully meet the requirements of back drilling 2 plug holes, and vacuum the inside of the through hole to eliminate air bubbles, the cost o

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  • Circuit board hole filling method and circuit board
  • Circuit board hole filling method and circuit board
  • Circuit board hole filling method and circuit board

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[0035] In order to be able to understand the above objectives, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the application and the features in the embodiments can be combined with each other if there is no conflict.

[0036] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited to the specific details disclosed below. Limitations of the embodiment.

[0037] image 3 A schematic flowchart of a method for plugging a hole on a circuit board according to an embodiment of the present invention is shown.

[0038] Such as image 3 As shown, a circuit board p...

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Abstract

The invention provides a circuit board hole filling method and a circuit board, and the method comprises the steps: plating an inner wall of a through hole on a circuit board with a metal layer with the preset thickness; placing a resin hole-filling material in the through hole with the formed metal layer; carrying out the grinding of the circuit board after the filling of the resin hole-filling material; carrying out the back drilling of the through hole of the circuit board after grinding, and forming a back drill hole; placing the resin hole-filling material in the back drill hole, and forming a blind resin jack; carrying out the grinding of the circuit board provided with the blind resin jack, so as to complete the hole-filling process of the circuit board. According to the technical scheme of the invention, the method can effectively reduce the residual bubbles after hole filling, improves the hole filling material, and reduces the production cost of a circuit board jack because a vacuum jack is avoided.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for plugging holes in a circuit board and a circuit board. Background technique [0002] At present, in the circuit board processing in the industry, the market has a design requirement to use resin plug holes for back drilling and through holes. There are two current solutions: [0003] One is: if figure 1 As shown, before using the printing machine aluminum sheet 1 to plug the holes, the back drilling 2 is completed. The processing method is: electroplating → controlled depth drilling → aluminum sheet resin plug hole → resin grinding → follow-up process. The biggest problem with this method is that there will be air bubbles 4 remaining at the step between the back-drilled hole 2 and the through hole 3, which will cause the resin plug hole to not be full. [0004] The other is: if figure 2 As shown, after the back-drilled hole 2 is made, a vacuum plugging ma...

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Application Information

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IPC IPC(8): H05K1/11H05K3/40
Inventor 周斌
Owner 新方正控股发展有限责任公司
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