Photosensitive module and method for forming the same
A technology of photosensitive module and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, radiation control device, electrical components, etc., can solve the problems of difficulty in reducing the thickness of bare die, damage, and high manufacturing cost, avoiding pollution and reducing overall size. Effect
Inactive Publication Date: 2016-07-06
XINTEC INC
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Problems solved by technology
[0003] However, the chip direct packaging technology needs to exert force on the die to stick it on the printed circuit board smoothly, so it is difficult to reduce the thickness of the die, otherwise it is easy to cause physical damage
Furthermore, the chip direct packaging technology requires a wire bonding process to form a conductive path, and the above-mentioned manufacturing process must be carried out in a cleanroom environment to ensure the quality and yield of the camera module, thus reducing the manufacturing cost. higher
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[0017] The fabrication and use of the embodiments of the present invention will be described in detail below. It should be noted, however, that the present invention provides many applicable inventive concepts, which can be embodied in a wide variety of specific forms. The specific embodiments discussed herein are merely specific ways to make and use the invention, and do not limit the scope of the invention. Furthermore, repeated reference numerals or designations may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing the present invention, and do not represent any relationship between the different embodiments and / or structures discussed. Furthermore, when it is mentioned that a first material layer is located on or above a second material layer, it includes the situation that the first material layer is in direct contact with the second material layer or is separated by one or more other material layers.
[0018] ...
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A method for forming a photosensitive module is provided. The method includes providing a substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A cover plate is provided on the first surface of the substrate. An opening is formed. The opening penetrates the substrate and exposes the conducting pad. A redistribution layer is formed in the first opening to electrically connect to the conducting pad. The cover plate is removed and a dicing process is performed to form a sensing device. The sensing device is bonded to a circuit board. An optical component is mounted on the circuit board and corresponds to the sensing device. A photosensitive module formed by the method is also provided.
Description
technical field [0001] The present invention relates to a photosensitive module and a manufacturing method thereof, in particular to a photosensitive module with a sensing device formed by a wafer-level packaging process. Background technique [0002] The production of camera modules usually adopts direct chip packaging (chiponboard, COB), such as directly pasting the die on the printed circuit board (printed circuit board, PCB) through adhesive glue, and bonding the die through the wire bonding process. The bare crystal is electrically connected to the printed circuit board, and then the lens and the holder are mounted on the printed circuit board. [0003] However, the chip direct packaging technology needs to exert force on the die to stick it on the printed circuit board smoothly, so it is difficult to reduce the thickness of the die, otherwise it is easy to cause physical damage. Furthermore, the chip direct packaging technology requires a wire bonding process to form ...
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IPC IPC(8): H01L27/146
CPCH01L27/14632H01L27/14634H01L27/14636H01L27/14687H01L27/1469H01L21/76898H01L23/481H01L27/14618H01L2224/16225
Inventor 廖季昌黄柏彰刘沧宇
Owner XINTEC INC