A production method for preventing surface oxidation of blind hole plate

Abstract

The invention relates to the field of printed circuit board manufacturing, in particular to a manufacturing method capable of protecting the surface of a blind hole board from oxidization.The manufacturing method mainly comprises a step S1 of manufacturing a multilayer board with blind holes; a step S2 of performing physical cleaning on a lowermost layer of the multilayer board; and a step S3 of performing press fit of the multilayer board and a metal base.The manufacturing method is simple in steps, the problem of oxidization of the surface of the blind hole board can be effectively solved, the problem that when the blind hole board is oxidized, manpower and material resources need to be spent for treatment is solved, resource and production time are greatly saved, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a method for preventing surface oxidation of blind hole boards. Background technique [0002] With the development of electronic products, some aluminum substrates with only single-layer circuit design can no longer meet the performance requirements. Double-layer, three-layer, and multi-layer aluminum substrates, including blind holes, have emerged as the times require. Before the inspection, it must be cleaned with a horizontal line. Whether it is a single-sided aluminum substrate or a single-sided double-layer aluminum plate, the hole diameter is generally greater than or equal to 0.4mm. When the finished product is cleaned with a horizontal line, the water in the hole can be dried. When the blind hole is equal to 0.15mm (such as figure 1 As shown), due to the small water in the thick hole of the board, the water cannot be dried and dried after passing the ho...

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic products, some aluminum substrates with only single-layer circuit design can no longer meet the performance requirements. Double-layer, three-layer, and multi-layer aluminum substrates, including blind holes, have emerged as the times require. Before the inspection, it must be cleaned with a horizontal line. Whether it is a single-sided aluminum substrate or a single-sided double-layer aluminum plate, the hole diameter is generally greater than or equal to 0.4mm. When the finished product is cleaned with a horizontal line, the water in the hole can be dried. When the blind hole is equal to 0.15mm (such as figure 1 As shown), due to the small water in the thick hole of the board, the water cannot be dried and dried after passing the horizontal line, resulting in poor oxidation of the metal layer in the blind hole area after a period of time, affecting the appearance and making it impossible to deliver

When there is an oxidation problem in the finished product, it takes a lot of manpower to wipe the surface oxidation with an eraser, which reduces production efficiency

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