Vapor chamber and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a temperature-uniforming plate, which comprises the steps of providing a flat first bottom plate with a first bottom surface, wherein the first bottom surface includes at least one cavity region; etching the first bottom plate to form at least two first grooves, and forming a non-etched first post between every two first grooves within the same cavity region; forming a first capillary structure on the surfaces of the first grooves and the first post; filling a working fluid in the first grooves; covering the adhesive on a first surface outside the cavity region; providing a second bottom plate with a second bottom surface, second grooves and a second post; laminating the first bottom plate and the second bottom plate together in the vacuum state to form a closed cavity by the first grooves and the second grooves; and curing the adhesive to obtain the temperature-uniforming plate. The invention also relates to a temperature-uniforming plate manufactured according to the above method.

Description

technical field [0001] The invention relates to heat dissipation, in particular to a uniform temperature plate and a manufacturing method thereof. Background technique [0002] In recent years, as the size of electronic devices gradually develops in the direction of thinner, thinner and smaller, the issue of heat dissipation of electronic devices has gradually been paid more and more attention. Especially the current consumer electronic products, such as digital cameras, mobile phones and notebook computers, etc., have more and more complex functions, and the number of power transistor components they contain is also increasing. Space is getting smaller and smaller, coupled with restrictions on the use of fans in order to reduce the noise generated by electronic devices, the problem of thermal management has become more serious and needs to be solved urgently. [0003] Among the many cooling devices, the vapor chamber, also known as flat plate heat pipe, has been widely use...

AI Technical Summary

Problems solved by technology

However, reducing the width of the cavity 12 will result in a reduction in the volume of the cavity 12, and the working fluid 14 that the cavity 12 can accommodate will also decrease, thereby affecting the heat dissipation effect.

Images