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Optoelectronic component comprising an adhesive layer and method for producing an adhesive layer in an optoelectronic component

An optoelectronic device and adhesion layer technology, applied in electrical components, semiconductor devices, coatings, etc., can solve the problem of heat not being able to be exported, and achieve the effect of stable temperature effect and radiation effect, good adhesion, and good adhesion characteristics.

Active Publication Date: 2016-07-13
OSRAM OPTO SEMICONDUCTORS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat generated can then be efficiently dissipated into the matrix material in the converter laminae, but remains as heat accumulation in the converter laminae since the heat cannot be dissipated via the strongly insulating adhesive layer of silicone

Method used

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  • Optoelectronic component comprising an adhesive layer and method for producing an adhesive layer in an optoelectronic component
  • Optoelectronic component comprising an adhesive layer and method for producing an adhesive layer in an optoelectronic component
  • Optoelectronic component comprising an adhesive layer and method for producing an adhesive layer in an optoelectronic component

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Embodiment Construction

[0115] according to figure 1 The optoelectronic component 1 shown in FIG. 1 shows a carrier 5 with a leadframe 6 . Arranged on the carrier 5 is a layer sequence 4 which is electrically connected to the leadframe 6 via bonding wires 7 . Above the layer sequence 4 is arranged the conversion platelet 3 . The converter platelets 3 comprise converter particles and a hybrid inorganic-organic material or converter particles and a silicate glass, wherein the converter particles are distributed eg homogeneously in the hybrid inorganic-organic material or in the silicate glass. The converter laminae 3 are arranged in the beam path of the electromagnetic primary radiation emitted by the active layers (not shown here) in the layer sequence 4 . An adhesive layer 2 is arranged between the layer sequence 4 and the converter laminae 3 . The adhesion layer 2 comprises an inorganic-organic hybrid material having Si-O-Si, Si-O-Al and Al-O-Al- or Si-O-Si, Si-O-Zr and Zr-O-Zr bonds. Adhesive l...

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Abstract

An optoelectronic component (1) is provided. This component comprises a sequence of layers (4) with an active layer, which emits primary electromagnetic radiation, and a converter platelet (3), which is arranged in the path of rays of the primary electromagnetic radiation. An adhesive layer (2) is disposed between the sequence of layers and the converter platelet, wherein the adhesive layer comprises an inorganic-organic hybrid material that has Si-O-Al bonds and / or Si-O-Zr bonds. The invention also relates to a method for producing the adhesive layer (2) in the optoelectronic component (1).

Description

technical field [0001] The invention relates to an optoelectronic component comprising an adhesion layer and a method for producing the adhesion layer in an optoelectronic component. [0002] This patent application claims priority from German patent application 102013112826.2, the disclosure of which is incorporated herein by reference. Background technique [0003] Optoelectronic components, such as light-emitting diodes (LEDs), often have converter platelets with converter particles. The conversion particles convert the radiation emitted by the radiation source into radiation having a changed, for example longer, wavelength. In this case, heat is generated in addition to the emitted modified radiation. In conventional converter platelets, converter particles are often embedded in a silicone matrix. Silicone, of course, has insufficient heat dissipation by converting the heat generated by the particles. This results in a heat build-up in the conversion element, which l...

Claims

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Application Information

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IPC IPC(8): C09D183/14C09J183/14H01L33/50
CPCC08G77/58C09J183/14H01L33/505H01L33/507H01L2933/0041H01L33/56H01L2933/005
Inventor 斯文·皮哈尔弗洛里安·埃德尔
Owner OSRAM OPTO SEMICONDUCTORS GMBH