Optoelectronic components and methods for their manufacture
A component, optoelectronic technology, applied in electrical components, electro-solid devices, circuits, etc., can solve problems such as process speed reduction, achieve rapid and safe identification, and save method steps.
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[0041] figure 1 Shows a perspective view of an optoelectronic component 100 designed according to a first embodiment of the invention, comprising a carrier 170 , an optoelectronic semiconductor chip 140 mounted on the carrier and an Housing 131. Here, used as a carrier is a lead frame 110 embedded in a molded body 130 formed of molding material. The housing 131 is designed in the present example with an elliptical contour which forms the cavity 132 for receiving the optoelectronic semiconductor chip 140 . The cavity 132 is divided into three sections 133 , 134 , 135 by two web-shaped structures extending transversely to the longitudinal axis of the elliptical housing. The optoelectronic semiconductor chip 140 is mounted directly on the surface of the frame element 110 in the central section 134 of the cavity 132 by means of solder or adhesive particles 141 . The lead frame 110 is constructed in two parts, wherein the semiconductor chip is fastened on the first lead frame pa...
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