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60results about How to "Padding achieved" patented technology

Aluminum alloy non-welding and roof tile solar heat collector

The invention discloses an aluminum alloy welding-free and roofing-tile solar collector, wherein, a collecting board is integrated with a heat-exchanging container; the solar collector is a section material with a semi-circle and tubular-shaped transect, the upper part of which is cambered and the lower part of which is flat, and connected with a plurality of aluminum alloy pipes which are connected with each other in parallel; the sunny side of the solar collector is coated with a selective heat absorption coating; water pipes which are arranged at the two sides of the solar collector and connected with the pipe section material are metal water pipes that are divided into an upper part and a lower part and has a pipe section material interface; the pipe section material and the water pipe are connected firmly by bolts and sealed by a sealant, and the upper part and the lower part of the water pipe are connected firmly by the bolts and sealed by the sealant; a glass cover plate is arranged on the pipe section material and the water pipe; a thermal insulation layer is arranged below the pipe section material and the water pipe; borders enclose the solar collector into a sealed whole at the periphery and extend out of regulas in all directions on the plane of the glass cover plate; the regulas on the left and right rise upwards so that the solar collection has the function of a large insulation roofing tile. The solar collector has the advantages of high heat collection efficiency, low price and long service life, basically requiring no maintenance, and being integrated with buildings and beneficial to scale production.
Owner:范东杰

Data filling method and data filling system based on quality control

The invention discloses a data filling method and a data filling system based on quality control. The data filling method includes the steps of determining missing data according to existing data of a database; establishing a data dependency relationship of the database, and determining a dependency confidence level of the data dependency relationship; determining deducible data and at least one group of non-deducible data in the missing data according to the existing data and the data dependency relationship; determining one group of to-be-retrieved data from the groups of non-deducible data according to a preset rule; deducing the deducible data according to the existing data and the data dependency relationship, and calculating a deduction confidence level according to the dependency confidence level; when the deduction confidence level is higher than a preset threshold value, filling the deducible data, retrieving the to-be-retrieved data from external resources, and calculating a retrieving confidence level according to the dependency confidence level; when the retrieving confidence level is higher than a preset threshold value, filling the to-be-retrieved data. The data filling method and the data filling system based on quality control have the advantages that by means of executing deducing and retrieving alternately, high filling accuracy can be guaranteed at small cost, and the confidence level is enabled to be high due to the fact that the dependency confidence level of the data dependency relationship is taken into consideration.
Owner:苏州大数据有限公司 +2

Preparation method of filling type sub-wavelength guide mode resonance optical filter

The invention relates to a production method of a filling type subwavelength guided mode resonance light filtering piece. The initial air filling type subwavelength grating is produced by adopting methods of plate covering light charactering and reaction ion beam etching, then film plating and etching are proceeded by taking the air filling type subwavelength grating as the base piece. The invention is characterized in that: a) a film plating uses a method of physics vacuum sediment, the material of the film is the material being filled in a grating groove and the thickness of the film is 2 times of the depth of the subwavelength grating groove; b) the reaction ion beam is used for etching the light filtering piece being plated, the etching thickness is 2 times of the depth of the subwavelength grating groove. The invention fills the material, the thickness of which has the exactitude to the nanometer grade in the grating groove with nanometer yardstick and which no doubt is one of the production in the light filtering pieces with the most difficult. The invention combines the plating technique and the etching technique to provide a practical and feasible etching production method; the method used can conveniently produce filling type subwavelength guided mode resonance light filtering pieces.
Owner:UNIV OF SHANGHAI FOR SCI & TECH

Film LED chip device based on compound low-resistance buffer structure and its making method

ActiveCN100580965CPadding achievedTo achieve electrical connectionSemiconductor devicesEngineeringLow resistance
The present invention provides a film LED chip device basing on the combined low-resistance buffer structure and the manufacturing method thereof, the insulating buffer film is packaged on side wall of all metal structures and is filled in all non-electrical connected areas, with filling in insulating buffer film between all metal convex points which connects the GaN base illuminating device and the electric polarized substrate, the filling-in thickness is a little under or even with the height of the metallic convex points, and with directly liking the GaN base illuminating device crystal disc with the whole surface of the electric polarized inversely mounted substrate with the mode of whole surface linking of the wafer, the metallic convex point of the conductive supporting thick metal layer and the insulating buffer film form the combined low-resistance buffer structure of the invention together, not only the electric connection between the GaN base illuminating device and the electric polarized inversely mounted substrate is realized, but also the buffer layer filling is realized thereby reducing the wafer rupture incidence rate of the subsequent laser stripping technique in order to increase the good product ratio, besides the stripped sapphire substrate disc which can execute finishing to the sapphire substrate and is obtained after stripped operation can be recovered for reusing, the production cost is reduced.
Owner:QUANZHOU SANAN SEMICON TECH CO LTD

Material perfusion and filling device and process for narrow and long space

ActiveCN104908193APadding achievedEnsure fullnessFeeding tubeMaterial storage
The invention relates to a material perfusion and filling device and process for narrow and long space. The device includes a perfusion host, a carrier zigzag conveying portion, a section bar positioning portion and a carrier traction portion. The carrier zigzag conveying portion is arranged at the left end of the perfusion and filling device; the section bar positioning portion is arranged in the middle of the perfusion and filling device; the carrier traction portion is arranged on the right end of the perfusion and filling device; the perfusion host is arranged on the external side of the junction of the carrier zigzag conveying portion and the section bar positioning portion; the perfusion host includes a base, a material storage container, a discharge port and a transfer pump; the material storage container, the discharge port and the transfer pump are fixedly disposed on the base, and the transfer pump t is respectively connected to the discharge port and the material storage container through the feed tubes. The device is capable of efficiently and quickly realize rapid and full material filling in workpiece with narrow filling space, greatly improves production efficiency, reduces waste and production costs and ensures quality and consistency of perfusion filling product, so that automated streamline production operation of that kind of perfusion and filling is possible.
Owner:京华派克邯郸机械科技有限公司

Method and device for rapidly filling vertical TSV hole with liquid alloy

The invention provides a method and device for rapidly filling a vertical TSV hole with liquid alloy, and relates to the field of microelectronic packaging. With solder alloy as a filling material, asilicon dioxide insulation layer is deposited on the surface of a TSV silicon wafer and in a blind hole in advance through chemical vapor deposition, a titanium barrier layer is deposited on the wallof the hole through physical vapor deposition, and finally, a copper layer is electroplated on the surface of the silicon wafer deposited with silicon dioxide to serve as a wet layer; and the obtainedwafer is placed in a vacuum chamber, the alloy is heated to be molten, the silicon wafer is pressurized when completely making contact with the molten alloy due to the wettability of the solder alloyand copper, the pressure in the vacuum chamber is maintained after pressurization, and filling is completed after the temperature is decreased. By the adoption of the method and device, the filling efficiency of the TSV hole can be improved, and imporous filling of a high-depth-wide-ratio TSV blind hole with the solder alloy is completed. The alloy and the wall of the TSV hole are firmly bonded together, and the filling process is simple. The TSV hole filling device comprises a vacuum outlet, a nitrogen inlet, a pressure gauge, a reaction chamber, a heating device and a temperature display device, wherein the vacuum outlet and the nitrogen inlet are controlled through valves.
Owner:BEIJING UNIV OF TECH

Multifunctional additive manufacturing device and method for hollow filling composite wires

ActiveCN112976567ARealize sub-regional manufacturingFacilitates real-time preparationAdditive manufacturing apparatus3D object support structuresKnife bladesMaterials science
The invention discloses a multifunctional additive manufacturing device and method for hollow filling composite wires. The multifunctional additive manufacturing device comprises a wire feeding pipe, the diameter of the upper section of the wire feeding pipe is uniform, the diameter of the lower section of the wire feeding pipe is gradually reduced, a heating block is arranged on the outer side of the diameter-gradually-reduced section of the wire feeding pipe, and a hollow base material is inserted into the wire feeding pipe in a penetrating mode; and the hollow base material extends into the wire feeding pipe through guiding of a wire guide wheel, the multifunctional additive manufacturing device further comprises an automatic filling device, the automatic filling device comprises a material mixing cavity, a feeding port and a discharging port are formed in the material mixing cavity, the discharging port is inserted into the junction of the diameter uniform section and the diameter gradually-reduced section of the wire feeding pipe in a penetrating mode, and a blade capable of splitting the side wall of the hollow base material is arranged at the upper part of the discharge port. According to the requirements of materials in different areas, the hollow base material can be filled with materials, and when the different areas are printed, the types and proportions of the materials are flexible and controllable.
Owner:XI AN JIAOTONG UNIV
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