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Electronic packaging device and underfilling method

A technology for electronic packaging and devices, which is applied in the field of electronic packaging devices and their underfills. It can solve problems such as the difficulty of filling small gaps and the difficulty of filling materials with underfills, so as to reduce the risk of short circuits between pins and reduce thermal expansion. Coefficient difference, effect of reducing stress shock

Inactive Publication Date: 2019-11-08
SHANGHAI XIANFANG SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Relying solely on the capillary effect, it is difficult for the underfill to meet the flow filling of the material. For large-sized chips, the incomplete filling effect is more obvious (such as the gap is less than 15um); and the SiO 2 and Al 2 o 3 It is difficult to fill tiny gaps when used as an underfill filler

Method used

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  • Electronic packaging device and underfilling method
  • Electronic packaging device and underfilling method
  • Electronic packaging device and underfilling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] This embodiment provides an electronic packaging device, including an underfill glue 3, a substrate 5, a chip 1, and a solder ball 2; wherein, the underfill glue 3 includes bisphenol A type epoxy resin and a magnetic material Fe 2 o 3 , Fe 2 o 3 The particle size is 50μm, bisphenol A epoxy resin and Fe 2 o 3 The mass ratio of the substrate is 7:3; the substrate and the chip are connected by solder balls;

[0045] The filling method of the above-mentioned electronic packaging device, comprising,

[0046] Place the underfill on one side of the chip, and place the magnet on the other side of the chip, such as figure 1 , and then preheat the device to 40°C, under the combined action of the magnetic force of the magnet and the capillary effect, the underfill glue flows to the other side of the chip to fill the gap between the substrate and the chip, such as figure 2 , and then heated at 120° C. for 10 minutes to obtain a bottom-filled electronic packaging device.

Embodiment 2

[0048] This embodiment provides an electronic packaging device, including an underfill glue 3, a substrate 5, a chip 1, and solder balls 2, wherein the underfill glue includes bisphenol A type epoxy resin and magnetic material CoFe 2 o 4 , bisphenol A epoxy resin and CoFe 2 o 4 The mass ratio is 1:1, CoFe 2 o 4 The particle size is 10nm, the CoFe in this embodiment 2 o 4 It uses atomic layer deposition technology to deposit a layer of SiO with a thickness of 1nm on its surface. 2 After modification, the substrate and the chip are connected by solder balls;

[0049] The filling method of the above-mentioned electronic packaging device, comprising,

[0050] Place the underfill on one side of the chip and the magnet on the bottom of the chip, see image 3 , and then preheat the device to 70°C, under the combined action of magnetic force and capillary effect, the underfill glue flows to the other side of the chip to fill the gap between the substrate and the chip, and then...

Embodiment 3

[0052] This embodiment provides an electronic packaging device, including an underfill glue 3, a substrate 5, a motherboard 6, and solder balls 2; wherein the underfill glue includes tetraphenol ethane tetraglycidyl ether epoxy resin, magnetic material nickel And silicon dioxide, the mass ratio of tetraphenol ethane tetraglycidyl ether epoxy resin, nickel and silicon dioxide is 8:1:1, and the nickel particle diameter is 500nm, and the nickel in the present embodiment adopts coupling agent γ-Aminopropyltriethoxysilane is used after surface treatment, and the substrate and the motherboard are connected by solder balls;

[0053] The filling method of the above-mentioned electronic packaging device, comprising,

[0054] Place the underfill on one side of the motherboard and the magnet on the other side of the motherboard, see Figure 4 , and then preheat the device to 60°C. Under the joint action of magnetic force and capillary effect, the underfill glue flows to the other side o...

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Abstract

The invention belongs to the technical field of semiconductor packaging, and particularly relates to application of magnetic materials as a bottom glue filling filler in an electronic packaging device, an electronic packaging device and an underfilling method thereof. The magnetic materials are taken as the bottom glue filling filler to achieve the filling of small gaps, reduce stress impact caused by large difference of the thermal expansion coefficient between a substrate and a chip and / or between a base and a mother board, improve the reliability, structural strength and the auto-dropping performance of the electronic package device.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to the application of a magnetic material as a bottom filling glue filler in an electronic packaging device, an electronic packaging device and a bottom filling method thereof. Background technique [0002] With the rapid development of the electronic components industry, which is the basis of the electronic information industry, the miniaturization and high integration of electronic products have become a development trend. With the development trend of miniaturization, portability and diversified functions of electronic products, the Reliability also puts forward higher and higher requirements. [0003] Due to the inconsistency of the coefficient of thermal expansion (CTE) between the chip / substrate or the substrate / substrate, during the operation of the chip, the heating of the chip will cause mechanical fatigue and cause the problem of solder joints f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/24H01L23/29H01L23/31H01L23/488H01L21/56
CPCH01L21/56H01L23/24H01L23/29H01L23/3121H01L23/488H01L2224/16225
Inventor 陈立军徐友志曹立强
Owner SHANGHAI XIANFANG SEMICON CO LTD
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