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32results about How to "Reduce stress shock" patented technology

LED device, LED lamp and method for processing conductive bonding wire of LED device

The invention discloses an LED device. The LED device comprises an LED chip, a support for bearing the LED chip, a conductive bonding wire for connecting an LED chip electrode and the support as well as a packaging glue body for covering the LED chip and the conductive bonding wire, wherein the support comprises an insulation area as well as a first electric connection area and a second electric connection area which are located on two sides of the insulation area respectively, the LED chip is mounted in the first electric connection area, one end of the conductive bonding wire is located at the LED chip electrode, the other end of the conductive bonding wire is located in the second electric connection area, and the conductive bonding wire comprises a vertical section, a first bending section, a second bending section and a connecting section. The invention further discloses an LED lamp and a method for processing the conductive bonding wire of the LED device. The stress bearing capacity of the conductive bonding wire is improved by a three-dimensional structure formed by the vertical section, the first bending section, the second bending section and the connecting section of the conductive bonding wire, so that the overall service life of the device is prolonged.
Owner:FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD

Preparation method of chemical material slurry plunger pump with composite coating, and product thereof

The invention relates to the technical field of a plunger pump, and particularly relates to a preparation method of a chemical material slurry plunger pump with composite coating, and a product thereof. The preparation method comprises the following preparation steps: performing undercutting for a part where coating of a plunger base body is, thereby reserving 0.25-0.35mm coating thickness, chamfering 40-50 degrees for a connection part between a coating edge and the base body; executing organic solvent degreasing and baking for the base body; then, performing sand blasting, using a clamp forprotecting a non-coating area; preheating the base body to 90-110 DEG C, spraying a nickel chrome bottom layer coating, wherein spraying current is 350-450A, voltage is 35-40V, and coating thickness is 0.08-0.12mm; spraying a chromic oxide coating, wherein spraying current is 500-600A, voltage is 40-50V, and coating thickness is 0.2-0.4mm; performing vacuum impregnation hole sealing, wherein impregnation time is 10-20 minutes, heating curing is executed after surface drying, and curing time is 1.5-2.5 hours; and using a grinding machine to perform grinding processing for the plunger, wherein grinding processing comprises three working procedures including coarse grinding, fine grinding and polishing. The chemical material slurry plunger pump with composite coating, prepared by the method of the invention has high corrosion resistance and abrasion resistance.
Owner:德清创智科技股份有限公司

Solder strip for laminated photovoltaic module and laminated photovoltaic module

The invention discloses a solder strip for a laminated photovoltaic module, which is prepared by locally stamping a circular copper wire to form a thin, long and flat middle section and a transition section with gradually-changed thicknesses, then integrally annealing, and coating the surface with a tin-lead alloy. The invention further discloses a laminated photovoltaic module with the solder strip. Through the structural optimization and annealing treatment of the solder strip, the overall yield strength of the solder strip is reduced, and the stress impact after the solder strip is in contact with a battery piece can be reduced. The solder strip and the battery piece are connected through an adhesive, and the adhesive is cured by several times; the manufactured laminated photovoltaic module can avoid hard contact of a battery piece, a solder strip and a battery piece in an overlapping region; the thickness of the adhesive is gradually increased, especially the stress impact in the laminating process can be resisted in the overlapping area, the process fragmentation risk is reduced, the production yield of the laminated photovoltaic module is improved, the subfissure risk of thepackaged module under the action of external stress is greatly reduced, and the reliability of the module is greatly improved.
Owner:CECEP SOLAR ENERGY TECH (ZHENJIANG) CO LTD

Independent pitch system and pitch method based on electric effective damping

The invention relates to an independent pitch changing system and a pitch changing method based on electric effective damping, which belong to the technical field of wind power generation. Its pitch system is that each of the blades has an independent pitch device, and the pitch device includes a pitch controller, a pitch driver, an electric damper and a pitch motor, and the pitch drivers are connected to the pitch controller respectively. The motor and the electric damper, the pitch controller are connected to the pitch driver, and the three pitch controllers are respectively connected to the main control controller of the wind turbine. Each blade of the wind turbine of the present invention independently changes the pitch angle according to its own control law, and by dynamically adjusting the pitch angles of the three blades respectively, each blade can obtain a different target position, reduce the dynamic balance load, and The asymmetrical rotor load compensation reduces the flapping vibration of the blades by the wind and reduces the stress impact of the transmission chain. When the wind speed is high, the variable generator torque and independent pitch angle are output to reduce the wind rotor speed and electric power fluctuations, and at the same time reduce the torque peak of the gearbox.
Owner:CHINA CREATIVE WIND ENERGY +3

Soft multi-core group ceramic capacitor and production method thereof

The invention provides a production method of a soft multi-core group ceramic capacitor. The production method comprises the steps of A welding a plurality of ceramic capacitor chips on a frame; B designing a packaging mold according to the welded structure of the frame and the ceramic capacitor chips, and printing the packaging mold through a 3D printing technology; C coating an insulating layeron the surface of the welded capacitor chips; D placing the frame and the ceramic capacitor chips processed in the step C in the packaging mold, and guiding packaging glue in for solidification to form a packaging glue layer, wherein the packaging glue layer is in a semi-solidified state; and E after demolding, coating the surface of the packaging glue layer with a protective layer. The inventionfurther provides the soft multi-core group ceramic capacitor. According to the invention, the number of the welding frame and the chips can be designed according to customer requirements, then the product appearance is reversely designed; the product appearance is enriched; the research and development period is greatly shortened; rapid mass production can be achieved; and extremely high shock resistance and environmental adaptability are achieved.
Owner:FUJIAN TORCH ELECTRON TECH CO LTD

Large solid garbage sorting machine

The invention discloses a large solid garbage sorting machine. The large solid garbage sorting machine comprises a vertical shell, a plurality of lining plates, a discharging nozzle and a material stopper, wherein material guide plates of the vertical shell are provided with the lining plates made of wear-resistant steel; a soft and elastic buffer plate is further arranged between each lining plate and the corresponding material guide plate; linear bearings are symmetrically arranged on the two sides of the left end of an opening frame of a vibration stock bin and connected with guide shafts in a shaft sleeve mode; the left end of the discharging nozzle is inserted and connected to a feeding port in a sleeved mode; vertical guide shafts are symmetrically arranged on the two sides of the right end of the discharging nozzle; the right end of the discharging nozzle and the left end of the opening frame are attached and vertically move; a weighing sensor module of the discharging nozzle monitors the material amount of the discharging nozzle in real time; the material stopper sleeves the right end of the discharging nozzle; and the inner cavity wall of the material stopper is higher than the opening frame. The large solid garbage sorting machine provided by the invention has the effects that automatic and stable feeding is achieved, the lining plates and the buffer base plates protect the material guide face, equipment maintenance is convenient, and the use efficiency is high.
Owner:江苏科选环境科技有限公司

LED device, LED lamp and method for processing conductive bonding wire of LED device

The invention discloses an LED device. The LED device comprises an LED chip, a support for bearing the LED chip, a conductive bonding wire for connecting an LED chip electrode and the support as well as a packaging glue body for covering the LED chip and the conductive bonding wire, wherein the support comprises an insulation area as well as a first electric connection area and a second electric connection area which are located on two sides of the insulation area respectively, the LED chip is mounted in the first electric connection area, one end of the conductive bonding wire is located at the LED chip electrode, the other end of the conductive bonding wire is located in the second electric connection area, and the conductive bonding wire comprises a vertical section, a first bending section, a second bending section and a connecting section. The invention further discloses an LED lamp and a method for processing the conductive bonding wire of the LED device. The stress bearing capacity of the conductive bonding wire is improved by a three-dimensional structure formed by the vertical section, the first bending section, the second bending section and the connecting section of the conductive bonding wire, so that the overall service life of the device is prolonged.
Owner:FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD

Anti-shaking metal stamping device

The invention discloses an anti-shaking metal stamping device, and relates to the field of metal processing. The anti-shaking metal stamping device comprises a base and a fixed frame body, and further comprises a stamping device and a driving device; the stamping device comprises a female die fixedly mounted on the fixed frame body and a male die movably mounted on the fixed frame body, and the stamping device is used for conducting stamping machining on metal raw materials through cooperation of the male die and the female die; and the driving device comprises a connecting component rotationally installed on the fixed frame body and a driving component fixedly installed on the fixed frame body, and the driving component is used for driving the connecting component to rotate on the fixed frame body so as to drive the male die to slide on the fixed frame body in a reciprocating manner. The anti-shaking metal stamping device is simple in structure, when the whole anti-shaking metal stamping device conducts continuous stamping operation on the metal raw materials, a buffer component effectively reduces stress impact on the male die, then the stability of the whole anti-shaking metal stamping device in the stamping process is improved, and the situation that the whole device shakes due to rigid impact in the stamping process is effectively prevented.
Owner:江苏久勋精密机械有限公司
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