2results about How to "Reduce stress shock" patented technology

This invention relates to the field of power engineering technology and discloses an offshore wind power DC transmission system and its operation method and apparatus. The system includes an offshore station, an onshore station, and a DC submarine cable. The offshore station has two independent AC buses: a first AC bus and a second AC bus. The offshore station also includes a first converter branch, a second converter branch, and a first MMC converter valve. The onshore station has a second MMC converter valve, which is connected to the first and second converter branches via the DC submarine cable. This invention designs two independent AC buses connected to the wind farm group respectively, with the two converter branches sharing the first MMC converter valve and serving as backups for each other. The dual buses reduce electrical coupling between wind farms; in the event of a fault, only the wind farm connected to a single bus is affected, and the short-circuit current is reduced due to weakened impedance coupling. The shared core equipment between the two converter branches reduces hardware costs, and the backup design prevents system outages caused by single-branch faults.

The invention relates to a miniature light-emitting device and a preparation method thereof, the device comprises a light-emitting structure, the light-emitting structure comprises an epitaxial layer and a first bonding metal layer which are stacked in sequence, a first opening is formed in the first bonding metal layer, and the first opening is filled with a self-repairing material; the self-repairing material is a material which is reduced into metal in an environment with a preset temperature; the driving structure comprises a driving substrate and a second bonding metal layer which are sequentially stacked, a second opening is formed in the second bonding metal layer, the second opening is filled with a self-repairing material, and the second bonding metal layer faces the first bonding metal layer and is bonded with the first bonding metal layer.