A kind of polyimide composite film and preparation method thereof

A polyimide, composite film technology, applied in chemical instruments and methods, flat products, other household appliances, etc., to achieve good bonding effect

A polyimide, composite film technology, applied in chemical instruments and methods, flat products, other household appliances, etc., to achieve good bonding effect

CN109823016BActive Publication Date: 2020-12-01NINGBO EXCITON TECH
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  • A kind of polyimide composite film and preparation method thereof
  • A kind of polyimide composite film and preparation method thereof
  • A kind of polyimide composite film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] The preparation method of polyimide composite film comprises the following steps:

[0079] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydride is polymerized, and the reaction time is 4 hours. The molar ratio of pyromellitic dianhydride: 4,4'-diaminodiphenyl ether: p-phenylenediamine is 1.00:0.50:0.502, and the average particle size is 3 μm Ultrasonic mixing of mica powder pre-dispersion, the amount of mica powder added accounted for 1wt% of the total amount of dianhydride monomers and diamine monomers, to obtain polyamic acid glue A;

[0080] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydri...

Embodiment 2

[0085] The preparation method of polyimide composite film comprises the following steps:

[0086] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydride is polymerized, and the reaction time is 4 hours. The molar ratio of pyromellitic dianhydride: 4,4'-diaminodiphenyl ether: p-phenylenediamine is 1.00:0.50:0.502, and the average particle size is 2 μm Ultrasonic mixing of mica powder pre-dispersion, the amount of mica powder added accounted for 2wt% of the total amount of dianhydride monomers and diamine monomers, to obtain polyamic acid glue A;

[0087] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydri...

Embodiment 3

[0092] The preparation method of polyimide composite film comprises the following steps:

[0093] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydride is polymerized, and the reaction time is 4 hours. The molar ratio of pyromellitic dianhydride: 4,4'-diaminodiphenyl ether: p-phenylenediamine is 1.00:0.50:0.502, and the average particle size is 6 μm Ultrasonic mixing of mica powder pre-dispersion, the amount of mica powder added accounted for 1wt% of the total amount of dianhydride monomers and diamine monomers, to obtain polyamic acid glue A;

[0094] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydri...

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Abstract

The invention belongs to the technical field of special engineering plastic films and particularly relates to a polyimide composite film and a preparation method thereof. The polyimide composite filmcomprises a layer A and a layer B, wherein the layer A comprises polyimide resin and inorganic filler, and the layer B comprises polyimide resin and porous particles. The preparation method includes the steps of firstly, preparing a size-stable polyamide acid gel solution A; secondly, preparing low-density buffer type polyamide acid gel solution B; thirdly, subjecting the polyamide acid gel solution A to tape casting film forming to obtain a gel film A; fourthly, coating two sides of the gel film A with the polyamide acid gel solution B; fifthly, stretching, and performing imidization to obtain the polyimide composite film. The preparation method can satisfy the processing requirements of sputtering-method adhesive-free flexible copper clad laminates. The prepared polyimide composite filmis high in double-sided copper foil binding force, high in size stability, excellent in bending resistance and the like.

Description

technical field [0001] The invention belongs to the technical field of special engineering plastic films, and in particular relates to a polyimide composite film and a preparation method thereof, which can meet the needs of light and thin flexible electronic printed circuit boards. Background technique [0002] Polyimide refers to a class of polymers containing imide rings (-CO-NH-CO-) in the main chain. It has excellent mechanical, dielectric, radiation resistance, and corrosion resistance at high temperatures. It is a One of the materials with the best comprehensive properties among organic polymer materials, [0003] With the development of high-tech such as ultra-large-scale integrated circuit manufacturing and packaging, my country's demand for high-performance polyimide films is increasing. With the thinning of electronic equipment, the trend of thinning electronic circuits, especially flexible circuits, is becoming more and more obvious. , polyimide film is the main f...

Claims

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Application Information

Patent Timeline
01 Dec 2020
Publication
CN109823016B
IPC
B32B27/08; B32B27/20; B32B27/28; B32B33/00; C08G73/10; B29D7/01
Inventors
张彦; 唐海江