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A kind of polyimide composite film and preparation method thereof

A polyimide, composite film technology, applied in chemical instruments and methods, flat products, other household appliances, etc., to achieve good bonding effect

Active Publication Date: 2020-12-01
NINGBO EXCITON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The surface layer (also known as the low-density functional layer) of the polyimide composite film prepared by the present invention has good sputtering bonding with copper foil. On the other hand, the present invention solves the domestic sputtering copper-plating base film supply problem

Method used

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  • A kind of polyimide composite film and preparation method thereof
  • A kind of polyimide composite film and preparation method thereof
  • A kind of polyimide composite film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] The preparation method of polyimide composite film comprises the following steps:

[0079] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydride is polymerized, and the reaction time is 4 hours. The molar ratio of pyromellitic dianhydride: 4,4'-diaminodiphenyl ether: p-phenylenediamine is 1.00:0.50:0.502, and the average particle size is 3 μm Ultrasonic mixing of mica powder pre-dispersion, the amount of mica powder added accounted for 1wt% of the total amount of dianhydride monomers and diamine monomers, to obtain polyamic acid glue A;

[0080] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydri...

Embodiment 2

[0085] The preparation method of polyimide composite film comprises the following steps:

[0086] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydride is polymerized, and the reaction time is 4 hours. The molar ratio of pyromellitic dianhydride: 4,4'-diaminodiphenyl ether: p-phenylenediamine is 1.00:0.50:0.502, and the average particle size is 2 μm Ultrasonic mixing of mica powder pre-dispersion, the amount of mica powder added accounted for 2wt% of the total amount of dianhydride monomers and diamine monomers, to obtain polyamic acid glue A;

[0087] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydri...

Embodiment 3

[0092] The preparation method of polyimide composite film comprises the following steps:

[0093] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydride is polymerized, and the reaction time is 4 hours. The molar ratio of pyromellitic dianhydride: 4,4'-diaminodiphenyl ether: p-phenylenediamine is 1.00:0.50:0.502, and the average particle size is 6 μm Ultrasonic mixing of mica powder pre-dispersion, the amount of mica powder added accounted for 1wt% of the total amount of dianhydride monomers and diamine monomers, to obtain polyamic acid glue A;

[0094] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic acid dianhydri...

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Abstract

The invention belongs to the technical field of special engineering plastic films and particularly relates to a polyimide composite film and a preparation method thereof. The polyimide composite filmcomprises a layer A and a layer B, wherein the layer A comprises polyimide resin and inorganic filler, and the layer B comprises polyimide resin and porous particles. The preparation method includes the steps of firstly, preparing a size-stable polyamide acid gel solution A; secondly, preparing low-density buffer type polyamide acid gel solution B; thirdly, subjecting the polyamide acid gel solution A to tape casting film forming to obtain a gel film A; fourthly, coating two sides of the gel film A with the polyamide acid gel solution B; fifthly, stretching, and performing imidization to obtain the polyimide composite film. The preparation method can satisfy the processing requirements of sputtering-method adhesive-free flexible copper clad laminates. The prepared polyimide composite filmis high in double-sided copper foil binding force, high in size stability, excellent in bending resistance and the like.

Description

technical field [0001] The invention belongs to the technical field of special engineering plastic films, and in particular relates to a polyimide composite film and a preparation method thereof, which can meet the needs of light and thin flexible electronic printed circuit boards. Background technique [0002] Polyimide refers to a class of polymers containing imide rings (-CO-NH-CO-) in the main chain. It has excellent mechanical, dielectric, radiation resistance, and corrosion resistance at high temperatures. It is a One of the materials with the best comprehensive properties among organic polymer materials, [0003] With the development of high-tech such as ultra-large-scale integrated circuit manufacturing and packaging, my country's demand for high-performance polyimide films is increasing. With the thinning of electronic equipment, the trend of thinning electronic circuits, especially flexible circuits, is becoming more and more obvious. , polyimide film is the main f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/08B32B27/20B32B27/28B32B33/00C08G73/10B29D7/01
Inventor 张彦唐海江吴小杰
Owner NINGBO EXCITON TECH
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