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Display panel, display device, and method for adjusting humidity in binding area of ​​display panel

A technology of display panel and binding area, applied in identification devices, static indicators, instruments, etc., can solve problems such as affecting the service life of products, long time, abnormal display in the display area of ​​the display panel, etc., to avoid the corrosion of connection pads , the effect of improving the service life

Inactive Publication Date: 2020-03-17
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Generally, the resin material in ACF glue has a certain degree of water absorption, and with the increase of time and environmental humidity, the water absorption will become larger and larger. To a certain extent, it will cause the connection pad (Lead) of the display panel binding area to corrode and cause the display The display area of ​​the panel is abnormal, and once the leads are short-circuited, the components will be burned
[0005] In addition, when customers use display products, they often have the habit of wiping the screen. When wiping, the cleaning fluid tends to seep into the gap between the edge of the display panel and the backplane, eventually causing water ingress.
Since the interior of the display product is a closed design without an air-drying device, the moisture inside it can only evaporate slowly, which takes a long time and is also prone to lead corrosion, which affects the service life of the product

Method used

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  • Display panel, display device, and method for adjusting humidity in binding area of ​​display panel
  • Display panel, display device, and method for adjusting humidity in binding area of ​​display panel
  • Display panel, display device, and method for adjusting humidity in binding area of ​​display panel

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Embodiment 1

[0039] combine Figures 1 to 3 As shown, this embodiment provides a display panel, which includes a display area and a binding area; wherein, the display area is provided with a display device for displaying a picture; a connection pad is provided in the binding area, and the connection pad Binding with the pins on the chip-on-film (COF) through ACF glue is used to transmit the display signal provided on the printed circuit board (PCBA) to the display device in the display area for displaying the screen. In particular, a humidity detection unit 1 and a heating unit 4 are also provided in the binding area of ​​the display panel in this embodiment; moreover, the display panel also includes a control unit 3 and a comparison unit 2; wherein the humidity detection unit 1 is used for real-time Detecting the humidity value of the binding area, and sending the detected humidity value to the comparison unit 2; the comparison unit 2 is used to compare the received humidity value with it...

Embodiment 2

[0053] This embodiment provides a method for adjusting humidity in a binding area of ​​a display panel, where the display panel may be the display panel in Embodiment 1. The humidity regulation method in the present embodiment may comprise the steps:

[0054] like Figure 4 As shown, step 1, real-time detection of the humidity value of the binding area.

[0055] This step specifically includes: detecting the humidity value of the binding area by the humidity detection unit 1 , and then outputting it to the comparison unit 2 .

[0056] Step 2, comparing the detected humidity value with the preset value stored in advance.

[0057] This step specifically includes: the comparison unit 2 compares the humidity value output by the humidity detection unit 1 with the preset value stored in advance, and when the result of the comparison is that the humidity value is greater than the preset value, output a high-level signal to the control Unit 3; when the comparison result is that the...

Embodiment 3

[0066] This embodiment provides a display device, which includes any one of the display panels in Embodiment 1. Therefore, the performance of the display panel of this embodiment is better.

[0067] Of course, the display device in this embodiment can be any product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.

[0068] Of course, the display device in this embodiment also has structures such as the outer frame of a conventional display device.

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Abstract

The invention provides a display panel, a display device and a humidity adjusting method for a bonding area of the display panel and belongs to the technical field of display. The display panel provided by the invention comprises the bonding area, a control unit and a comparison unit, wherein a humidity detecting unit and a heating unit are arranged in the bonding area; the humidity detecting unit is used for detecting a humidity value of the bonding area in real time and sending the detected humidity value to the comparison unit; the comparison unit is used for comparing the received humidity value with a pre-stored preset value and sending a comparison result to the control unit; and the control unit is used for controlling the heating unit to heat the bonding area or not according to the received comparison result. The display panel provided by the invention can be used for avoiding the problem of corrosion of a connecting bonding pad in the bonding area.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a display panel, a display device, and a humidity adjustment method for a binding area of ​​the display panel. Background technique [0002] In the traditional display panel design, the chip-on-chip (COF) is bonded to the binding area of ​​the display panel through ACF glue (anisotropic conductive glue). ACF glue belongs to anisotropic conductive film, mainly including resin Adhesive and conductive particles are two parts. Among them, the function of resin adhesive is not only to have the functions of adhesion, heat resistance and insulation, but also to fix the relative position of the electrode between the IC chip and the substrate, and to provide a pressing force to maintain the electrode and conductive particles. The contact area between them ensures the continuity of the circuit. [0003] This Bonding technology has the following disadvantages: [0004] Genera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/00G09G3/00
CPCG09F9/00G09G3/006
Inventor 刘晓锋李东熙郑辉盖欣李晓虎
Owner BOE TECH GRP CO LTD
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