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A power module with matrix arrangement of electrode connection points

A technology of matrix arrangement and power modules, which is applied in the direction of circuits, electrical components, and electric solid-state devices, can solve the problems of large loss and large stray inductance, and achieve the effects of improving reliability, reducing area, and shortening length

Active Publication Date: 2019-03-22
YANGZHOU GUOYANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Power modules in the prior art often have large stray inductance and large losses

Method used

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  • A power module with matrix arrangement of electrode connection points
  • A power module with matrix arrangement of electrode connection points

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Embodiment Construction

[0019] The technical solution of the present invention will be further elaborated below in conjunction with the accompanying drawings.

[0020] Such as figure 1 As shown, the present invention discloses a power module with electrode connection points arranged in a matrix, including six insulating substrates arranged in a row, of which the three insulating substrates on the left are the lower half-bridge insulating substrates, which are respectively the first lower half-bridge insulating substrates 1. The second lower half-bridge insulating substrate 2 and the third lower half-bridge insulating substrate 3, and the three insulating substrates on the right are the upper half-bridge insulating substrates, which are respectively the first upper half-bridge insulating substrate 4 and the second upper half-bridge insulating substrate 5 and the third upper half-bridge insulating substrate 6 .

[0021] Such as figure 2 As shown, the first lower half-bridge insulating substrate 1, t...

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Abstract

The invention discloses a power module of electrode connection point matrix arrangement. The module comprises a plurality of insulation substrates which are arranged in a row. A right half side of each insulation substrate is provided with a plurality of power supply electrode connection points which are arranged in a column. The power supply electrode connection points of all the insulation substrates are arranged in a matrix mode. In the power module, through optimizing a chip position layout on the insulation substrate, the right half side of each insulation substrate is provided with a plurality of power supply electrode connection points which are arranged in a column and power supply electrode connection points of all the insulation substrates are arranged in a matrix mode so that a stray inductance and module losses are effectively reduced. An half-bridge unit, an upper half-bridge follow current unit, a lower half-bridge unit and a lower half-bridge follow current unit adopt a partition connection and gate pole leading out mode so that a length of a power switch chip gate pole leading wire is effectively shortened, which means that an area of a gate pole loop is reduced, and work reliability is increased.

Description

technical field [0001] The invention relates to the field of power electronics, in particular to a power module in which electrode connection points are arranged in a matrix. Background technique [0002] The power module is a power switch module packaged by power electronic devices such as metal oxide semiconductors (power MOS tubes), insulated gate field effect transistors (IGBTs), and fast recovery diodes (FRDs) according to certain functions. Power conversion in various occasions such as automobiles, photovoltaic power generation, wind power generation, and industrial frequency conversion. [0003] Power modules in the prior art often have large stray inductance and large loss. Contents of the invention [0004] Purpose of the invention: The purpose of the invention is to provide a power module with a matrix arrangement of electrode connection points with small stray inductance and low loss. [0005] Technical scheme: in order to achieve this goal, the present invent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H01L23/12
Inventor 王玉林徐文辉滕鹤松
Owner YANGZHOU GUOYANG ELECTRONICS CO LTD
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