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A substrate for semiconductor lasers

A technology of lasers and semiconductors, applied in semiconductor lasers, structural details of semiconductor lasers, lasers, etc., can solve problems such as low heat conduction efficiency and complicated packaging process, and achieve the effects of simplifying manufacturing process steps, improving heat dissipation efficiency, and reducing quantity

Active Publication Date: 2019-01-08
FOCUSLIGHT TECH
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  • Summary
  • Abstract
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Problems solved by technology

[0006] In order to solve the problems of low heat conduction efficiency and complicated packaging process of the existing semiconductor laser packaging structure, the present invention proposes a new substrate applied to semiconductor lasers

Method used

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  • A substrate for semiconductor lasers
  • A substrate for semiconductor lasers
  • A substrate for semiconductor lasers

Examples

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Embodiment Construction

[0033] like figure 2 As shown, the laser chip 1 is assembled on a substrate 20 with high thermal conductivity and CTE matching, and one or more laser chips and the corresponding substrate are directly assembled and bonded to the radiator 6 through solder 5 to form a semiconductor laser . The substrate has conductivity in the chip stacking direction (the conductive area covers at least the chip bonding area), and has insulation in the direction perpendicular to the surface of the heat sink.

[0034] like image 3 , the substrate 20 is a composite body composed of insulating materials and conductive materials. The insulating material and the conductive material are closely combined. Such an integrated substrate realizes both conduction and insulation. Compared with the existing conductive substrate plus insulating block bonding The combination of two bonded interfaces and a solder layer (5 to 10 microns thick) are reduced. The layout of the insulating material and the conduc...

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Abstract

The invention proposes a substrate applied to a semiconductor laser unit and solves the problems of relatively low heat conduction efficiency and relatively complicated packaging process of an existing conduction-cooled semiconductor laser unit packaging structure. A laser unit chip bonding region is arranged on the front surface of the substrate and / or the back surface of the substrate, and the bottom surface of the substrate serves as a bonding surface of a heat dissipater; the substrate is a composite body composed of an insulating material and a conductive material, and the layout of the insulating material and the conductive material in the composite body ensures that the part from the front surface of the substrate to the back surface of the substrate is conductively communicated in the composite body in a manner of corresponding to the laser unit chip bonding region; and the laser unit chip bonding region is insulated from the bottom of the substrate.

Description

technical field [0001] The invention relates to a substrate applied to a semiconductor laser. Background technique [0002] like figure 1 A common semiconductor laser packaging structure is shown, the heat dissipation path of the laser chip is as follows: the heat generated by the semiconductor laser chip 1 is first conducted to the substrate 2, then to the insulating block 4 through the solder layer 3, and then through the solder layer 5 is conducted to the radiator 6. The heat conduction path from the laser chip to the heat sink is long and there are many interfaces, which reduces the heat dissipation capability of the entire laser. [0003] Due to the requirements of structure and process, the thickness of the insulating block 4 generally needs to reach more than 300 microns, which also limits its heat conduction efficiency. At the same time, the solder layer is required for assembly and bonding between the insulating block, the laser chip substrate and the heat sink, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/022H01S5/02H01S5/024
CPCH01S5/0208H01S5/024H01S5/02345
Inventor 刘兴胜蔡万绍陶春华邢卓宋涛
Owner FOCUSLIGHT TECH
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