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Automatic grinding device for silicon wafer

A technology for grinding devices and silicon wafers, which is applied in the direction of grinding devices, grinding drive devices, grinding machine tools, etc., which can solve problems such as low efficiency, difficulty in grasping the flatness of grinding, and scale deviation, and achieve high-quality results

Inactive Publication Date: 2016-08-10
SUZHOU ZHANJIN ELECTROMECHANICAL EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the production process of the silicon wafer, there may be a certain deviation in the scale, so it needs to be calibrated back and forth on the grinding wheel by manual hand-holding. However, due to the hand-held method, this operation will bring the following disadvantages: 1. Waste of special grinding 1 labor force; 2, due to slight shaking during the hand-holding process, it is difficult to grasp the flatness of the grinding, and the scrap rate is relatively high; manual operation is relatively inefficient

Method used

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  • Automatic grinding device for silicon wafer
  • Automatic grinding device for silicon wafer
  • Automatic grinding device for silicon wafer

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Embodiment Construction

[0018] The silicon chip automatic grinding device of the present invention comprises a frame 1, which is provided with an X-axis traverse mechanism that reciprocates left and right, a Y-axis feed mechanism that reciprocates back and forth, and an air motor connected to the Y-axis feed mechanism. 12 Rotary mechanism, air motor 12 The rotary mechanism is provided with a grinding head for grinding silicon wafers. By adopting the above structure, the X-axis traversing mechanism is used to replace the manual back-and-forth hand-held operation, the Y-axis feed mechanism is used to replace the operation of manually changing the grinding surface of the silicon wafer, and the air motor 12 rotating mechanism is used to drive the grinding head to rotate quickly to achieve high speed. Grinding of quality silicon wafers.

[0019] The above-mentioned X-axis traversing mechanism includes an X-axis table 2, two guide rails 3 arranged symmetrically on the X-axis table 2, an X-axis drive motor ...

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Abstract

The invention discloses an automatic grinding device for silicon wafers, which includes a frame, and is characterized in that: the frame is provided with an X-axis traverse mechanism that reciprocates left and right, a Y-axis feed mechanism that reciprocates back and forth, and The Y-axis feed mechanism is connected to an air motor rotating mechanism, and a grinding head for grinding silicon wafers is arranged on the air motor rotating mechanism. By adopting the above structure, the X-axis traversing mechanism is used to replace the manual back-and-forth hand-held operation, the Y-axis feed mechanism is used to replace the operation of manually changing the grinding surface of the silicon wafer, and the air motor rotation mechanism is used to drive the grinding head to rotate quickly to achieve high quality. Grinding of silicon wafers.

Description

technical field [0001] The invention relates to an automatic silicon wafer grinding device, in particular to an automatic silicon wafer grinding device with high production efficiency and convenient processing. Background technique [0002] During the production process of the silicon wafer, there may be a certain deviation in the scale, so it needs to be calibrated back and forth on the grinding wheel by manual hand-holding. However, due to the hand-held method, this operation will bring the following disadvantages: 1. Waste of special grinding 1 labor force; 2, due to slight shaking during the hand-holding process, it is difficult to grasp the flatness of the grinding, and the scrap rate is relatively high; manual operation is relatively inefficient. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an automatic grinding device for silicon wafers, which has the characteristics of high production efficiency and co...

Claims

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Application Information

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IPC IPC(8): B24B37/10B24B7/22B24B47/20B24B47/04B24B41/02
CPCB24B37/10B24B7/228B24B41/02B24B47/04B24B47/20
Inventor 吉成东
Owner SUZHOU ZHANJIN ELECTROMECHANICAL EQUIP CO LTD