Sheet material assembly structure and combination method thereof

Abstract

The board assembly structure and its combination method provided by the present invention utilize the flange structure and the groove structure provided on the ring side of the board, and the fillet arrangement between the flange structure and the groove structure adjacent to the two boards, Make the plate and the plate more closely, and use the relative melting point characteristics of the material of the molding and the material of the board. After the assembly of the board and the molding is completed, apply high pressure and high temperature to make the molding into a molten state, and the flange The surface of the structure and the groove structure is completely covered, and then the adjacent panels are bonded and fixed. With the setting of the combined structure and the use of its combination method, multiple panels are repeatedly connected to form a strong and durable floor, cabinet or light. compartment.

Description

technical field [0001] The present invention relates to a plate assembly structure and its combination method, especially to a plate through which the flange structure and the groove structure are engaged and arranged, and the meltable fillet corresponding to the shape of the flange structure and the groove structure is used. As the medium between the boards, the adjacent boards can be more tightly clamped or even bonded to achieve the purpose of combining to form a solid floor, cabinet or light compartment. Background technique [0002] The boards of the floor, cabinet body or light compartment in the prior art generally only use chemical colloids for bonding, or use the flange structure between the boards and the groove structure to engage and fix them, and then use chemical colloids to bond the boards and the boards. The interface of the boards is coated and bonded to strengthen the tightness and structural strength of the connection between the boards. [0003] However,...

AI Technical Summary

Problems solved by technology

[0003] However, there are many shortcomings in the existing method of bonding boards with chemical colloids. If only chemical colloids are used to bond boards, the improvement of the firmness is quite limited. After a long time, the chemical colloids will easily fall off and cause the boards to separate and disintegrate. Danger

If the flange structure and the groove structure between the plates are used at the same time to be fixed and then coated and bonded with chemical colloid, although the above-mentioned disintegration problem caused by the long-term shedding of the chemical colloid can be effectively solved, the interface between the plates If the chemical colloid is not applied carefully enough, water vapor will easily enter the board from the gap between the board and the board, and it will also easily cause mildew and embrittlement of the board in the long run, causing danger, so it is necessary to improve it

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