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Device and method for detecting photo-alignment substrate

A detection device and detection method technology, applied in optics, nonlinear optics, instruments, etc., can solve problems such as hysteresis, photo-alignment substrate substrate limit detection, etc.

Inactive Publication Date: 2019-09-06
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is how to solve the limitations of the existing photo-alignment substrate detection method due to the substrate type and the detection hysteresis

Method used

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  • Device and method for detecting photo-alignment substrate
  • Device and method for detecting photo-alignment substrate
  • Device and method for detecting photo-alignment substrate

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Embodiment Construction

[0034] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] like figure 2 As shown, the embodiment of the present invention provides a detection device for an optical alignment substrate, including: a light source device 11 and an optical detection device 15;

[0036] The light source device 11 is used to emit polarized light 12 to the light alignment substrate 13 to be measured; wherein, the polarized light 12 reaches the light alignment substrate 13 to be measured and is reflected to form reflected light 14;

[0037] The optical detection device 15 is used to detect the light intensity of the reflected light 14 when the alignment direction of the optical alignment substrate 13 to be tested and the polarization direction of the polarized light 12 are at different angles; wherein, the polarized light The polarization direction is parallel to the photo-alignment substrate to be tested.

[0038] It should...

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Abstract

The invention relates to a detection device and method of an optical alignment substrate. The detection device comprises light source equipment and optical detection equipment; the light source equipment is used for emitting polarized light to the optical alignment substrate to be detected, wherein after the polarized light reaches the optical alignment substrate to be detected, the polarized light is reflected to form reflection light; the optical detection equipment is used for detecting light intensity of the reflection light when an alignment direction of the optical alignment substrate to be detected and a polarization direction of the polarized light form different included angles. According to the detection device and method of the optical alignment substrate, provided by the embodiment of the invention, the light intensity of the reflection light of the polarized light which is emitted into the optical alignment substrate to be detected is detected when the polarization direction of the optical alignment substrate to be detected and the polarization direction of the polarized light form the different included angles; the absorption intensity of the optical alignment substrate to be detected can be obtained when the included angles are different according to the light intensity change of the reflection light, and an alignment angle of the optical alignment substrate to be detected, the alignment intensity and the uniformity of the alignment of the whole substrate are determined.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display manufacturing, in particular to a detection device and method for a photo-alignment substrate. Background technique [0002] Thin-film transistor (TFT) technology has developed rapidly since the 1990s. In less than 10 years, TFT-LCD has rapidly grown into a mainstream display. The large-scale semiconductor full integrated circuit manufacturing technology using new materials and new processes is Fundamentals of liquid crystal (LC), inorganic and organic thin-film electroluminescent (EL and OEL) flat panel displays. TFT is a non-single wafer or wafer such as glass or plastic substrates, which forms various films necessary for manufacturing circuits through sputtering and chemical deposition processes, and produces large-scale semiconductor integrated circuits (LSICs) through film processing. The use of non-single crystal substrates can greatly reduce costs, and is an extension of tra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13G02F1/1337
Inventor 张军李亚君
Owner BOE TECH GRP CO LTD