Transistor assembling and dispensing machine

Abstract

The invention discloses a glue dispensing machine for assembly of transistors. A shell feeding device, a silicon chip feeding device, a glue dispensing device and a feeding device are respectively arranged on the outer periphery of a turntable, and when the turntable rotates, the first casing installation groove is sequentially positioned on the casing. Body loading station, silicon wafer loading station, glue dispensing station, and unloading station. When working, the shell loading device first loads the shell into the first shell installation groove, and then the silicon The wafer feeding device feeds silicon wafers to the silicon wafer installation position on the housing, and finally the dispensing mechanism performs dispensing, and the unloading device unloads the transistor components after dispensing to realize the continuous completion of transistor assembly and dispensing; At the same time, through the movement and switching of the slider between the discharge channel of the discharge structure and the first housing installation position of the turntable, it is ensured that the housings are loaded one by one and the loading position is accurate, thereby ensuring the assembly and dispensing accuracy of the transistor components.

Description

technical field [0001] The invention relates to the technical field of transistor processing, in particular to a transistor assembly dispenser. Background technique [0002] In the transistor assembly process, glue dispensing is a necessary process, and glue dispensing is essentially to apply glue or other fluid materials on the surface of components. At the beginning, the dispensing work was done manually by workers. With the advancement of technology, many semi-automatic dispensing machines have also been produced, and more and more fully automatic dispensing machines have emerged one after another. With the emergence of more and more precision products, the requirements for dispensing are getting higher and higher, and during the transportation and feeding process of transistors, the pins are easily squeezed and deformed, which has a great impact on the reliability and accuracy of dispensing. During the gluing process, it is necessary to reshape the pins, which consumes ...

AI Technical Summary

Problems solved by technology

With the emergence of more and more precision products, the requirements for dispensing are getting higher and higher, and during the transportation and feeding process of transistors, the pins are easily squeezed and deformed, which has a great impact on the reliability and accuracy of dispensing. During the gluing process, it is necessary to reshape the pins, which takes a lot of time, so the current dispensing process seriously affects the production efficiency of the whole line

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