Check patentability & draft patents in minutes with Patsnap Eureka AI!

Microlenses for multibeam arrays of optoelectronic devices for high frequency operation

A technology of laser arrays and microlenses, which is applied to laser parts, lasers, electrical components, etc., can solve regulatory problems, safety interference and other problems

Active Publication Date: 2016-08-17
朗美通经营有限责任公司
View PDF20 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there are radio frequency methods that will work in these near field ranges, these have disadvantages including omnidirectional transmission which is a safety issue and regulatory issues due to RF interference issues

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microlenses for multibeam arrays of optoelectronic devices for high frequency operation
  • Microlenses for multibeam arrays of optoelectronic devices for high frequency operation
  • Microlenses for multibeam arrays of optoelectronic devices for high frequency operation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] A VCSEL array device such as that described in U.S. Patent No. 5,812,571 is a flip-chip VCSEL array device that employs a metal contact layer that also serves as a reflector for the top mirror and is formed on each above the countertop. This single metal layer is typically deposited using techniques such as electron beam (e-beam) evaporation or sputtering to create a highly uniform or reflective surface. Although these deposition techniques are normal for the application, they are inappropriate when seeking to achieve thick metal layers surrounding the mesas, which is crucial for improved heat reduction in such devices. In order to deposit sufficiently thick layers using existing techniques, large quantities of metals, such as gold (Au), must be used, which significantly increases the cost of such equipment. This type of design, as well as that of other existing VCSEL array devices, also increases the overall impedance of the system and complicates thermal management, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A VCSEL array device formed of a monolithic array of raised VCSELs on an electrical contact and raised inactive regions connected to the electrical contact. The VCSELs can be spaced symmetrically or asymmetrically, in a manner to improve power or speed, or in phase and in parallel. The raised VCSELs and raised inactive regions are positioned between the electrical contact and an electrical waveguide. The VCSELs may be separated into subarrays and each VCSEL may be covered with an integrated or bonded microlens for directing light without external lenses. The microlenses may be offset to collect or collimate light and may be shaped to form various lens profiles.

Description

[0001] Cross References to Related Applications [0002] This international application claims the benefit of U.S. Patent Application No. 13 / 902,555, filed May 24, 2013; Multibeam Arrays of Optoelectronic Devices for High Frequency Operation (Multibeam Arrays of Optoelectronic Devices for High Frequency Operation) filed on February 17, 2010, entitled "Multibeam Arrays of Optoelectronic Devices for High Frequency Operation" Arrays)," U.S. Patent Application No. 12 / 707,657, now U.S. Patent No. 7,949,024; Multi-Beam Array)" U.S. Patent Application No. 61 / 153,190. [0003] This international application also claims the benefit of U.S. Patent Application No. 13 / 868,034, entitled "Addressable Illuminator with Eye-Safety Circuitry," filed April 22, 2013, which U.S. Patent Application Claims the Benefit of Provisional U.S. Patent Application No. 61 / 636,570, entitled "Addressable Illuminator with Eye-Safety Circuitry," filed April 20, 2012, above The content is incorporated herein by ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01S3/101
Inventor 约翰·R·约瑟夫理查德·F·卡森米亚尔·E·瓦伦凯文·L·利尔
Owner 朗美通经营有限责任公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com