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Microlenses for multi-beam arrays of optoelectronic devices operating at high frequencies

A laser array and microlens technology, applied in laser parts, lasers, electrical components, etc., can solve problems such as safety interference and supervision issues

Active Publication Date: 2019-02-22
朗美通经营有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there are radio frequency methods that will work in these near field ranges, these have disadvantages including omnidirectional transmission which is a safety issue and regulatory issues due to RF interference issues

Method used

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  • Microlenses for multi-beam arrays of optoelectronic devices operating at high frequencies
  • Microlenses for multi-beam arrays of optoelectronic devices operating at high frequencies
  • Microlenses for multi-beam arrays of optoelectronic devices operating at high frequencies

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Embodiment Construction

[0040] The VCSEL array device (such as the VCSEL array device described in U.S. Patent No. 5,812,571) is a flip-chip VCSEL array device using a metal contact layer that also serves as a reflector for the top mirror and is formed in each Above the countertop. The single metal layer is usually deposited using techniques such as electron beam (e-beam) evaporation or sputtering to create a highly uniform or reflective surface. Although these deposition techniques are normal for the application, they are not appropriate when seeking to achieve a thick metal layer surrounding the mesa, which is essential for improved heat reduction in such devices. In order to deposit sufficiently thick layers using existing techniques, a large amount of metal such as gold (Au) must be used, which significantly increases the cost of such equipment. This type of design and the design of other existing VCSEL array devices also increases the total impedance of the system and complicates thermal managem...

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Abstract

A VCSEL array device formed from a monolithic array of raised VCSELs on electrical contacts and raised inactive regions connected to the electrical contacts. The VCSELs can be spaced symmetrically or asymmetrically or in phase and in parallel in a manner that increases power or speed. Raised VCSELs and raised inactive regions are disposed between the electrical contacts and the electrical waveguide. The VCSELs can be divided into sub-arrays, and each VCSEL can be covered with an integrated or bonded microlens for directing light without external lenses. Microlenses can be offset to collect or collimate light, and can be shaped to form various lens profiles.

Description

[0001] Cross references to related applications [0002] This international application claims the benefits of U.S. Patent Application No. 13 / 902,555 filed on May 24, 2013; and relates to the title "Multibeam Arrays of Optoelectronic Devices for High Frequency Operation" filed on March 31, 2011. Multibeam Arrays of Optoelectronic Devices for High Frequency Operation" US Patent Application No. 13 / 077,769; filed on February 17, 2010 entitled "Multibeam Arrays of Optoelectronic Devices for High Frequency Operation (Multibeam Arrays of Optoelectronic Devices for High Frequency Operation) Array)" U.S. Patent Application No. 12 / 707,657, now U.S. Patent No. 7,949,024; and filed on February 17, 2009 entitled "Multibeam Arrays of Optoelectronic Devices for High Frequency Operation Optoelectronic Devices for High Frequency Operation Multi-beam array)" US Patent Application No. 61 / 153,190. [0003] This international application also claims the rights and interests of U.S. Patent Application ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S3/101
Inventor 约翰·R·约瑟夫理查德·F·卡森米亚尔·E·瓦伦凯文·L·利尔
Owner 朗美通经营有限责任公司
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