An integrated detection mechanism for detection, sorting and sorting of chip components

Abstract

The invention discloses an integrated detection mechanism for chip component detection and separation. The integrated detection mechanism comprises three major parts, namely an inner layer arrangement mechanism, an outer layer detection mechanism and a screening mechanism; the an inner layer arrangement mechanism, the outer layer detection mechanism and the screening mechanism are all arranged on an annular base, the base is supported by a base support and a first central main shaft sleeve, and the first shaft sleeve presses a speed change device. Elements which are arranged well can be output and detected from multiple tracks at the same time only by pouring the scattered elements from a middle feeding position. The whole mechanism runs smoothly, and compared with traditional detection mechanisms, detection efficiency is greatly improved. Meanwhile, an industrial camera and an ultrasonic fault detection head are comprehensively applied for detection, more items can be detected, element quality is judged more completely, and the misjudgment rate is lower. The element detection process does not need to be stopped, and damage to elements caused when material picking and discharging are conducted through a material picker is avoided. In addition, aggregation of unqualified elements can be achieved.

Description

technical field [0001] The invention relates to the technical field of chip component detection, in particular to an integrated detection mechanism for chip component detection, sorting and sorting. Background technique [0002] With the rapid development of the information industry revolution, the complexity of electronic devices and systems is increasing, and the number of electronic components required is also increasing. From the perspective of reliability, the quality requirements for electronic components are also getting higher and higher. [0003] SMD components are currently the most important components in electronic equipment, and their quality screening plays an important role in improving the reliability of electronic equipment. At this stage, the machines used for online component detection are mainly attached to the braiding machine, and the components need to be placed on a transparent detection platform during the detection, and after the detection is compl...

AI Technical Summary

Problems solved by technology

However, the mechanism itself cannot arrange the piles of scattered components, and if the components are arranged closely, some components may stand upright or even turn over when the stopper rod distributes materials.

[0005] Taiwan patent TWI372135 [testing device of electronic component testing and sorting machine], its main purpose is also in order to shorten the waiting time of testing device, this invention has utilized two retrieving devices, carries out retrieving in turn, to reduce the stand-by time of testing station, but It will also take a certain amount of time when the two reclaimers switch

With the increasingly higher requirements for the detection speed of electronic components and the limitation of camera exposure time, the technical means contained in the above patents cannot meet the requirements for efficient and fast testing of bulk electronic components.

[0006] Both of the above two solutions improve the low efficiency of the traditional one-by-one picking method by changing the picking method, but they still cannot achieve non-stop testing, and both need to add an additional component arrangement machine before testing

At the same time, it cannot solve the problems of low detection efficiency and few integrated functions of existing related devices

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