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Apparatus and method for blind pixel detection of thermal infrared hyperspectral imager

A hyperspectral imaging and thermal infrared technology, applied in measurement devices, optical instrument testing, instruments, etc., to avoid missed detection and false detection, and improve detection accuracy

Inactive Publication Date: 2016-08-24
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0004] The problem to be solved by the present invention is to provide a device and method suitable for blind element detection of thermal infrared hyperspectral imagers. The method detects from the perspective of spectral dimension and solves the problem of blind element detection of thermal infrared hyperspectral imagers

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  • Apparatus and method for blind pixel detection of thermal infrared hyperspectral imager

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings.

[0033] figure 1 A composition structure diagram of a device suitable for blind element detection of a thermal infrared hyperspectral imager is described. The device is composed of a blackbody controller, a radiation blackbody, a thermal infrared spectral imager and a computer module, wherein:

[0034] (1) The black body controller realizes the temperature control of the radiation black body and adjusts the black body to different temperatures;

[0035] (2) The radiation black body is a standard object of thermal radiation, which can emit stable radiation signals. The radiation field of view of the body in this device should be larger than the field of view of the imaging spectrometer;

[0036] (3) The thermal infrared hyperspectral imager is the instrument and equipment to be detected;

[0037] (4) The computer module includes a data acquisition unit and a blind ele...

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Abstract

The invention relates to an apparatus and method for blind pixel detection of a thermal infrared hyperspectral imager. The apparatus includes a black body controller, a radiation black body, a thermal infrared hyperspectral imager and a computer module. The computer module includes a data acquisition unit and a blind pixel detection unit. By using the apparatus, the method comprises the steps of (1) aligning the thermal infrared hyperspectral imager with the black body and filling the field of view, setting the temperature of the black body as the number of N (N> / =30) different temperatures via the black body controller, and controlling, via the data acquisition unit, the imager to acquire N groups of data after the temperature is stabilized; (2) conducting wave band superimposition for the N groups of data according to the temperature rise, and generating temperature rise black body thermal infrared hyperspectral data; and (3) acquiring a non-blind pixel temperature rise spectrum, conducting blind pixel detection by means of spectrum matching, marking blind pixels and generating a blind pixel detection result. The invention achieves blind pixel high-precision detection of the thermal infrared hyperspectral imager from the viewpoint of spectral dimension, and plays an important role in calibration and data pre-processing of the thermal infrared hyperspectral imager.

Description

technical field [0001] The invention belongs to the field of remote sensing detection and imaging spectrometer calibration, in particular to a device and method for blind element detection of a thermal infrared hyperspectral imager. Background technique [0002] Due to the casting process or environmental changes of infrared detection components, blind elements will commonly exist in thermal infrared hyperspectral images. The existence of blind elements will seriously affect the image quality of linear array push-broom thermal infrared hyperspectral imagers, and affect the radiation calibration accuracy. will also have an impact. Therefore, blind element detection is a necessary link before image radiation correction, and the quality of blind element detection directly affects the subsequent data processing and image quality evaluation of the image. [0003] At present, the methods of blind element detection include laboratory calibration method and scene-based method. Thes...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01M11/00
CPCG01M11/00
Inventor 张长兴谢锋刘成玉邵红兰刘智慧杨贵
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI