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A multi-layer flexible board manufacturing method capable of avoiding misalignment between layers and the multi-layer flexible board

A production method and interlayer dislocation technology, applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as interlayer dislocation, and achieve the effect of improving production efficiency, improving product reliability, and simplifying the pressing process.

Active Publication Date: 2019-01-11
SHENZHEN KINWONG ELECTRONICS
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  • Claims
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Problems solved by technology

[0004] In view of the deficiencies in the prior art above, the purpose of the present invention is to provide a multi-layer flexible board manufacturing method and a multi-layer flexible board that can avoid interlayer misalignment, aiming to solve the problem of using ordinary fast presses for existing multi-layer flexible boards. During the pressing process, it is easy to cause misalignment between layers

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  • A multi-layer flexible board manufacturing method capable of avoiding misalignment between layers and the multi-layer flexible board
  • A multi-layer flexible board manufacturing method capable of avoiding misalignment between layers and the multi-layer flexible board
  • A multi-layer flexible board manufacturing method capable of avoiding misalignment between layers and the multi-layer flexible board

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[0025] The present invention provides a multi-layer flexible board manufacturing method and a multi-layer flexible board that can avoid misalignment between layers. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] like figure 2 As shown, it is a flow chart of a preferred embodiment of a multi-layer soft board manufacturing method that can avoid interlayer misalignment provided by the present invention, which includes steps:

[0027] S101, first carry out adhesive treatment on the soft board;

[0028] S102, stacking a plurality of flexible boards sequentially, during the stacking process, the adhesive surface of the flexible board is superimposed on the non-adhesive surface of another flexible boa...

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Abstract

The invention discloses a multilayer soft plate manufacturing method capable of avoiding interlayer dislocation and a multilayer soft plate. The method comprises the steps of: A, firstly carrying out back glue processing on soft plates; B, superposing a plurality of soft plates in sequence, wherein in the superposing process, a back glue surface of one soft plate is superposed with a non-back-glue surface of another soft plate, the back glue surface is arranged on the upper layer and the non-back-glue surface is arranged on the lower layer; C, placing the plurality of superposed soft plates in a area to be pressed and carrying out pressing processing; and D, carrying out solidification on the plurality of pressed soft plates. According to the invention, the problem of interlayer dislocation caused in the pressing process of a common rapid pressing machine is effectively improved, the non-compaction phenomenon is simultaneously avoided, and guarantee is provided for using the common rapid pressing machine to produce the multilayer soft plate; the phenomena of drilling offset and poor hole copper connection caused by interlayer dislocation of the multilayer soft plate are further improved, and the reliability of the product is improved; in addition, the production efficiency of the multilayer soft plate is substantially improved, and the pressing process after the superposing of the multilayer soft plate is simpler.

Description

technical field [0001] The invention relates to the field of multi-layer flexible boards, in particular to a method for avoiding interlayer misalignment when the multi-layer boards are stacked and pressed by an ordinary fast press, and a multi-layer flexible board manufactured in this way. Background technique [0002] The pressing equipment after stacking multi-layer flexible boards includes: single-opening vacuum press, traditional vacuum press, and ordinary fast press. The first two kinds of pressing equipment adopt vacuum lamination, which will not cause misalignment between layers, but the lamination efficiency of single opening is low, which is not suitable for mass production. The traditional vacuum press is not easy to operate, and is not suitable for small batch production of samples. The ordinary fast press is easy to operate and has high efficiency, such as figure 1 As shown, when the upper mold and the lower mold press the multi-layer flexible board 10, they wil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4635H05K2203/068
Inventor 刘文汪明舒建平华兵杨贻相李泰巍杨志旺
Owner SHENZHEN KINWONG ELECTRONICS
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