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A laser drilling system for hard and brittle materials

A hard and brittle material, laser drilling technology, used in laser welding equipment, metal processing equipment, welding equipment and other directions, can solve the problems of low processing efficiency, low material removal rate of single pulse, etc., to achieve the effect of improving processing efficiency

Active Publication Date: 2019-04-12
HANS LASER TECH IND GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The material removal rate of the single pulse of the ultrafast laser is low, and the processing efficiency is low under the condition of low frequency. Especially for the processing of multiple microholes distributed regularly, the ultrafast laser back etching drilling method shows low processing efficiency. Defects

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  • A laser drilling system for hard and brittle materials
  • A laser drilling system for hard and brittle materials
  • A laser drilling system for hard and brittle materials

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Embodiment Construction

[0023] Now in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.

[0024] Such as figure 1 As shown, the present invention provides a preferred embodiment of a laser drilling system for hard and brittle materials.

[0025] A laser drilling system for hard and brittle materials includes an ultrafast laser 10 , a beam splitter 21 unit and a focusing unit 30 arranged in sequence, and the focusing unit 30 is arranged on a hard and brittle material 40 to be processed. Specifically, the ultrafast laser beam 10 emits an ultrafast laser beam 11; the beam splitter 21 unit includes a beam splitter 21 and an optical lens assembly 22, and the ultrafast laser beam 11 sequentially passes through the beam splitter 21 and the optical lens assembly 22 to form several Ultrafast laser beam 11, and incident in the focusing unit 30; Focusing unit 30 is arranged on the hard and brittle material 40 to be processed, and this fo...

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Abstract

The invention relates to the field of laser drilling, in particular to a laser drilling system for a hard and brittle material. The laser drilling system comprises an ultrafast-laser laser, a beam splitter unit and a focusing unit, wherein the ultrafast-laser laser emits ultrafast laser beams; the beam splitter unit comprises a beam splitter and an optical lens assembly, the ultrafast laser beams sequentially pass through the beam splitter and the optical lens assembly to form multiple paths of ultrafast laser beams, and the ultrafast laser beams enter the focusing unit; and the focusing unit is arranged on the hard and brittle material to be machined. According to the laser drilling system for the hard and brittle material, the ultrafast laser beams form multiple paths of ultrafast laser beams through the beam splitter, taper-free through holes are drilled in the back of the hard and brittle material to be machined through a back etching technology, and machining efficiency is improved.

Description

technical field [0001] The invention relates to the field of laser drilling, in particular to a laser drilling system for hard and brittle materials. Background technique [0002] Drilling techniques for transparent hard and brittle materials such as glass, sapphire, and transparent ceramics mostly use mechanical processing. However, the efficiency of this method is low, and it is difficult to process holes smaller than 1mm for sapphire materials with higher hardness. [0003] With the development of laser processing technology, laser drilling technology has attracted market attention in the processing of transparent hard and brittle materials. There are two methods of laser drilling, front ablation and back etching. The holes drilled by the front ablation method have a >5° taper, which cannot meet the demanding requirements of the market. The backside etching method can avoid the disadvantage of taper produced by the front ablation drilling technology, and the hole wa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/064B23K26/402
CPCB23K26/064B23K26/382B23K26/402
Inventor 苑学瑞张小军卢建刚马国东唐建刚尹建刚高云峰
Owner HANS LASER TECH IND GRP CO LTD