Method for automatically generating pcb stackup diagram

Abstract

The invention discloses a method for automatically generating a PCB stacked drawing. The method includes: establishing a database, writing a PCB number program, writing a main body stacked structure, writing a copper reduction rule of various working processes, writing parts and hole structures, writing a board thickness calculation rule, linking an ERP work order database, and implementing uploading of an ERP function. A basic stacked drawing is automatically generated according to the number of layers without manual drawing, and the efficiency is improved; the number of breakover layers and positions of holes in the stacked structure such as cavity groove holes can be freely adjusted according to the demands of a client; copper loss in different working processes can be automatically calculated, and then the board thickness is more accurate; and an automatic parameter uploading function can be achieved without inputting work order parameters manually, and the production efficiency can be improved.

Description

technical field [0001] The invention relates to a computer program, in particular to a method for automatically generating a PCB stackup diagram. Background technique [0002] The existing software used in the PCB industry has the following defects: the adjustment of the hole structure and position in the stack cannot be realized; the loss of copper cannot be reduced according to the process flow, resulting in inaccurate calculation of the board thickness; the stack cannot be realized The parameter values ​​in the work order are directly brought into the work order, resulting in the need to manually enter the parameters twice in the work order, which leads to low production efficiency and increased error rate. Contents of the invention [0003] In order to overcome the above defects, the present invention provides a method for automatically generating PCB stackup diagrams. [0004] The technical scheme that the present invention adopts in order to solve its technical prob...

AI Technical Summary

Problems solved by technology

[0002] The existing software used in the PCB industry has the following defects: the adjustment of the hole structure and position in the stack cannot be realized; the loss of copper cannot be reduced according to the process flow, resulting in inaccurate calculation of the board thickness; the stack cannot be realized The parameter values ​​in the work order are directly brought into the work order, resulting in the need to manually enter the parameters twice in the work order, which leads to low production efficiency and increased error rate

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