Flexible multi-junction solar cell and fabrication method thereof

Abstract

The invention discloses a flexible multi-junction solar cell and a fabrication method thereof. The multi-junction cell sequentially comprises a flexible substrate, bonding metals and a multi-junction cell epitaxial structure from bottom to top, wherein the flexible substrate is a metal material thin film whose the coefficient of thermal expansion is lower than those of bonding metal layers, and the thin film can provide a support effect with certain flexibleness and also can be used for balancing the pull stress of the bonding metal layers on the epitaxial structure so that the cell is in a balance state before the cell is finally used. The multi-junction cell disclosed by the invention has flexibleness and can be applicable to most curved surface occasions; with the adoption of a traditional upper / lower electrode structure, the multi-junction cell is convenient to package; and moreover, the all-metal structure is very beneficial for heat dissipation.

Description

technical field [0001] The invention relates to a method for manufacturing a solar cell, which belongs to the technical field of semiconductor devices and processes. Background technique [0002] In recent years, with the application of space solar cells, high-power concentrated solar cells based on flexible substrates have gradually replaced traditional cells due to their advantages of light weight, rollability, portability, and high power-to-weight ratio. hotspots. [0003] Commonly used flexible substrates with better reliability are mostly insulating materials with low thermal conductivity. It is difficult to meet the heat dissipation requirements for the use end with high heat dissipation requirements; in addition, the thermal expansion of these organic materials and semiconductor and metal materials There are also certain differences in the coefficients. After the process is completed, the flexible battery is often in a bent state, which increases the difficulty of th...

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Problems solved by technology

[0003] Commonly used flexible substrates with better reliability are mostly insulating materials with low thermal conductivity. It is difficult to meet the heat dissipation requirements for the use end with high heat dissipation requirements; in addition, the thermal expansion of these organic materials and semiconductor and metal materials There are also certain differences in the coefficients. After the process is completed, the flexible battery is often in a bent state, which increases the difficulty of the back-end application.

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