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Method of measuring an adhesive force of interlayer adhesive layer in tensile mode and apparatus

A technology of adhesive layer and adhesive force, which is applied in the direction of measuring devices, semiconductor/solid-state device testing/measurement, machine/structural component testing, etc., can solve the problems of accurate and reliable measurement difficulties, etc.

Active Publication Date: 2016-09-14
SK HYNIX INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, accurate and reliable measurements are difficult

Method used

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  • Method of measuring an adhesive force of interlayer adhesive layer in tensile mode and apparatus
  • Method of measuring an adhesive force of interlayer adhesive layer in tensile mode and apparatus
  • Method of measuring an adhesive force of interlayer adhesive layer in tensile mode and apparatus

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Embodiment Construction

[0034] Embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings.

[0035] Embodiments of the present disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, And will fully convey the concept of this disclosure to those skilled in the art. Meanwhile, the terminology used herein is only for the purpose of describing specific implementations, and is not intended to limit the implementations.

[0036] Also, the thickness or size of layers in the drawings may be exaggerated for convenience of explanation and clarity, and the same reference numerals denote the same elements in the drawings. As used herein, the term "and / or" means any and all combinations of one or more of the associated listed items.

[0037] The terminology used herein is for the ...

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PUM

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Abstract

The invention relates to a method of measuring an adhesive force of an interlayer adhesive layer in a tensile mode and an apparatus. The method includes providing a device under test, which includes a lower test layer and an upper test layer that is stacked on the lower test layer and includes an overhang protruding past an edge of the lower test layer by a predetermined length, fixing the lower test layer onto a mounting stage, and measuring adhesive force of an interlayer adhesive layer in a tensile mode by applying a load to a bottom surface of the overhang of the upper test layer in a first direction. The apparatus includes a mounting stage fixing the device under test, a load applying tip applying the load to the bottom surface of the overhang, a location adjuster adjusting a distance between the device under test and the load carrying tip, a load cell detecting a magnitude of the applied load, and a controller controlling the location adjuster and the load cell.

Description

technical field [0001] The present invention relates to a method of measuring an adhesive force in a tensile mode of an interlayer adhesive layer used in a laminated semiconductor device and an apparatus for measuring the adhesive force. Background technique [0002] Semiconductor chips (wafers) are packaged and electrically connected to external circuits to constitute electronic devices. When a semiconductor chip is packaged, the semiconductor chip is attached on another semiconductor chip or a substrate such as a printed circuit board (PCB) by means of an interlayer adhesive layer such as an adhesive or an adhesive film. [0003] In a semiconductor package including an interlayer adhesive layer, if the adhesive strength of the interlayer adhesive layer is insufficient, cracking or peeling may occur at the bonding interface between adjacent layers during fabrication or use of the semiconductor package, thereby Defects are generated in the electrical connection between semi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L22/12G01M1/00G01N2203/0017G01N2203/0025H01L2224/32145H01L2224/48091H01L2224/48145H01L2224/73265G01N19/04H01L2924/00014H01L2924/00
Inventor 申东吉尹喆根姜敃圭李圭济
Owner SK HYNIX INC