The invention discloses a measuring method and device for focusing and leveling, and relates to a new method for the focusing and leveling 
sensor system of a 
wafer applicable to the projection 
photolithography system, and belongs to the field of optical measurement. The invention consists of three parts, namely, a 
light source collimating module, a focusing subsystem and a leveling subsystem. The 
laser of the invention emits 
laser light, the 
laser light is collimated by a single mode 
fiber and then passes through a drift compensation device, and then permeates a polarized optical splitter and a 
Lambda fourth wave plate and then shines on a measured 
silicon chip. The 
ray is led to pass through the measured 
silicon chip repeatedly through a planar mirror and a corner cube 
prism, and then is magnified in front of a 
position detector by a lens 
system, thereby obtaining the defocusing information of the 
silicon chip surface. The 
ray is rebounded along the path by a planar optical splitter, the 
ray permeates a lens and shines on a position-sensitive 
detector, thereby obtaining the two-dimensional inclination information of the 
silicon chip surface. The 
system has 
high resolution as well as simple structure of 
optical path and needs no complicated optical design.