Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Focusing leveling measuring method and device

A technology for focusing, leveling, and measuring systems, applied in the field of optical measurement, to achieve the effects of reducing errors, stabilizing the measurement system, and improving measurement resolution and measurement accuracy

Inactive Publication Date: 2008-04-30
BEIJING INSTITUTE OF TECHNOLOGYGY
View PDF0 Cites 32 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So that the whole system can meet the focus and leveling requirements of the current resolution projection lithography machine below 100nm

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Focusing leveling measuring method and device
  • Focusing leveling measuring method and device
  • Focusing leveling measuring method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] Further illustrate the present invention below in conjunction with accompanying drawing.

[0044] As shown in FIG. 3 , it is a schematic structural diagram of a focusing and leveling system of a photolithography machine according to the present invention. Each component module of the optical system of the present invention will be described one by one in conjunction with FIG. 3 below. The light source collimation module 301 emits highly stable collimated laser light, which becomes linearly polarized light through the polarization beam splitter 302, passes through the λ / 4 wave plate 305, passes through the plane mirror 310, and is incident on the surface 311 of the silicon wafer to be measured. The light is reflected from the silicon wafer surface 311 and the plane mirror 312 to the half mirror 313 . The half-reflector 313 splits the light into two parts (reflected light and transmitted light). The reflected light returns in reverse along the original optical path, tha...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a measuring method and device for focusing and leveling, and relates to a new method for the focusing and leveling sensor system of a wafer applicable to the projection photolithography system, and belongs to the field of optical measurement. The invention consists of three parts, namely, a light source collimating module, a focusing subsystem and a leveling subsystem. The laser of the invention emits laser light, the laser light is collimated by a single mode fiber and then passes through a drift compensation device, and then permeates a polarized optical splitter and a Lambda fourth wave plate and then shines on a measured silicon chip. The ray is led to pass through the measured silicon chip repeatedly through a planar mirror and a corner cube prism, and then is magnified in front of a position detector by a lens system, thereby obtaining the defocusing information of the silicon chip surface. The ray is rebounded along the path by a planar optical splitter, the ray permeates a lens and shines on a position-sensitive detector, thereby obtaining the two-dimensional inclination information of the silicon chip surface. The system has high resolution as well as simple structure of optical path and needs no complicated optical design.

Description

technical field [0001] The invention relates to a focusing and leveling detection method and device applied in a projection lithography system, which is used for high-precision detection of the distance between the surface of the exposed silicon wafer and the projection objective lens and the two-dimensional inclination angle of the silicon wafer, belonging to the optical measurement field. Background technique [0002] In the projection lithography system, the silicon wafer focusing and leveling measurement system is used in the lithography machine to measure the height and rotation angle (Z, θ) of the silicon wafer surface relative to the projection objective lens X and θ Y ), and three actuators vertical to the workpiece table form a feedback system to control the vertical position of the silicon wafer in real time to ensure that the current field of the silicon wafer is always within the focal depth range of the projection objective during the exposure process. In the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/00G03F7/20
Inventor 匡翠方李艳秋刘丽辉
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com