LED bracket and LED package structure

Abstract

The invention relates to an LED bracket and an LED package structure employing the same. The LED bracket comprises an insulating substrate, a first electrode pad and a second electrode pad, wherein a bowl-type solid crystal region and a strip-shaped insulating part located in the bowl-type solid crystal region are formed on the insulating substrate; the first electrode pad and the second electrode pad are fixed on the insulating substrate and are located at the bottom part of the bowl-type solid crystal region through the strip-shaped insulating part at an interval; and the strip-shaped insulating part is provided with at least one bent part in the bowl-type solid crystal region. Through the structural design of the electrode pads on the LED bracket, one electrode pad, such as an anode pad is enough in size to bond a wire of a wire bonding machine or to place a zener diode chip, and the other electrode pad is as large as possible, so that LED chips can be medially and symmetrically distributed on the LED bracket; and the target of improving the light-emitting efficiency and the heat dissipation effect of each chip is achieved.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an LED bracket and an LED packaging structure. Background technique [0002] The LED (Light Emitting Diode, light-emitting diode) support in the prior art usually includes: insulating substrate, anode pad and negative electrode pad; Wherein, the insulating substrate is typically provided with a crystal-bonding area in the center, and the positive electrode pad and the negative electrode pad are fixed on the insulating substrate and are spaced apart from each other at the bottom of the crystal-bonding region, and the area of ​​the negative electrode pad in the crystal-bonding region is larger than the area of ​​the positive electrode pad in the crystal-bonding region. When this kind of LED bracket is applied to LED chip packaging, the LED chip will be fixed on the negative pad in the die bonding area and connected to the positive pad and the negative pad by wire bonding. [0003] Ho...

AI Technical Summary

Problems solved by technology

[0003] However, because the area of ​​the existing positive electrode pad in the die-bonding area is too large, the LED chip cannot be placed in the center of the die-bonding area during the LED chip packaging process, which will reduce the luminous efficiency of the LED chip; and Since the area of ​​the positive electrode pad in the die-bonding area is larger, the area of ​​the negative electrode pad in the die-bonding area becomes smaller, and the LED chips are all placed on the negative electrode pad, which will reduce the heat dissipation effect on the LED chip.

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