Array substrate mother board, manufacture method and display device thereof
An array substrate and manufacturing method technology, applied in the display field, can solve problems such as prone to sags, uneven display products, and uneven diffusion of alignment films, so as to improve the diffusion effect and avoid the bad effects of Mura
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Embodiment 1
[0068] This embodiment provides a method for manufacturing an array substrate mother board, which at least includes forming a film layer pattern of a first display product on a first area of the base substrate and forming a film layer of a second display product on a second area of the base substrate Graphics, the deep hole density of the first display product is greater than the deep hole density of the second display product, and the deep holes are via holes penetrating through at least two insulating layers. The manufacturing method includes:
[0069] Before forming the second conductive pattern on the insulating layer, the thickness of the insulating layer in the first region is reduced, and the second conductive pattern is connected to the first conductive pattern under the insulating layer through the via hole structure penetrating through the insulating layer. Graphical connections.
[0070] In this embodiment, when forming the film pattern of different display prod...
Embodiment 2
[0103] This embodiment provides an array substrate motherboard. The array substrate motherboard at least includes the film layer pattern of the first display product formed on the first area of the base substrate and the second display pattern formed on the second area of the base substrate. The film layer pattern of the product, the deep hole density of the first display product is greater than the deep hole density of the second display product, the deep holes are via holes penetrating through at least two insulating layers, and the array substrate includes The first conductive pattern and the second conductive pattern on the insulating layer, the second conductive pattern is connected to the first conductive pattern through the via structure through the insulating layer, wherein all the first regions The thickness of the insulating layer is smaller than the thickness of the insulating layer in the second region.
[0104] In this embodiment, when the film layer patterns ...
Embodiment 3
[0117] This embodiment provides a display device, including the above-mentioned first region. The display device may be any product or component with a display function such as a liquid crystal panel, a liquid crystal TV, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer, a navigator, and an electronic paper.
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